Samsung Unveils New 10.7Gbps LPDDR5X DRAM Using Advanced 12nm Technology

Published by Hilbert Hagedoorn 2

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Samsung Electronics has announced the development of the industry's first LPDDR5X DRAM, capable of reaching speeds up to 10.7 gigabits per second, making it the fastest currently available. This advancement utilizes a 12 nanometer-class process technology, which enables Samsung to achieve the smallest chip size in the LPDDR category, reinforcing its position in the low-power DRAM market. YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics, highlighted the growing demand for low-power, high-performance memory across various sectors including mobile devices, PCs, servers, and automotive applications. This new memory technology is poised to meet the increasing requirements for on-device AI applications, which necessitate robust processing capabilities directly on the devices.
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Micron Advances NAND Technology with 232-Layer QLC Production for Various Storage Solutions

Published by Hilbert Hagedoorn 0

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Micron Technology, Inc. has achieved a significant milestone in NAND technology by initiating mass production of its 232-layer QLC NAND, now available in select Crucial SSDs. This advancement is also reaching enterprise storage customers through volume production and is being sampled by OEM PC manufacturers as part of the Micron 2500 NVMe SSD lineup. The new 232-layer QLC NAND by Micron is designed to enhance performance in multiple storage applications including mobile devices, client computers, edge technology, and data centers. This technology showcases notable improvements in efficiency and speed, featuring industry-leading bit density that achieves a 28% reduction in size compared to its closest competitors' most recent offerings. It also delivers a notable increase in NAND I/O speeds, reaching up to 2400 MT/s, which represents a 50% improvement over previous models.
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Lenovo Introduces ThinkCentre M75 Gen 5 Desktops Featuring AMD Ryzen PRO 8000 Series

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Lenovo has launched its latest ThinkCentre desktop series, the M75 Gen 5, featuring AMD Ryzen PRO 8000 Series processors. These desktops are equipped with up to 16 TOPS of integrated NPU capacity, designed specifically to handle AI-related tasks. The series includes the ThinkCentre M75t Gen 5, a performance-oriented tower; the flexible ThinkCentre M75s Gen 5 in a small form factor; and the compact ThinkCentre M75q Gen 5. Sanjeev Menon, Vice President and General Manager at Lenovo, highlighted the company's commitment to integrating AI technology to meet growing business demands. The ThinkCentre M75 series is tailored to enhance productivity through AI without significant investment, featuring robust power supplies, component upgradeability, and advanced thermal management.
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Microsoft Announces End of Support for Office 2016 and 2019 in October 2025

Published by Hilbert Hagedoorn 1

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Microsoft has officially announced that it will discontinue support for all applications within the Office 2016 and 2019 suites, including popular programs such as Excel, Word, and PowerPoint, effective October 14, 2025. The same cessation date applies to Windows 10 support. Post October 2025, Microsoft will no longer provide new features, updates, security patches, or customer support for these versions. The discontinuation is anticipated to pose potential security risks, productivity declines, and compatibility problems for users who continue using the outdated software. To mitigate these issues, Microsoft recommends transitioning to the Microsoft 365 E3 cloud suite, which provides similar functionalities.
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CORSAIR Launches HS35 v2 Series Gaming Headsets with Multi-Platform Support

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CORSAIR announced the release of its HS35 v2 series gaming headsets, including the HS35 v2 and HS35 SURROUND v2 models. These headsets are designed to enhance the audio experience across various gaming platforms due to their universal 3.5mm connectivity, making them compatible with PCs, PlayStation, Xbox, and Nintendo Switch.The HS35 v2 series features custom-tuned 50mm neodymium drivers that deliver a broad and dynamic range of sound, enhancing the auditory detail within games. Additionally, the HS35 SURROUND v2 model includes a USB receiver that activates Dolby Audio 7.1 surround sound on PC and Mac, providing a more immersive audio environment. This feature is particularly beneficial in competitive games, allowing players to accurately discern the direction of enemy movements and audio cues.
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AMD Launches Ryzen PRO 8000 and 8040 Series APUs with AI Capabilities for Business Use

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AMD unveiled two new series of Accelerated Processing Units (APUs) specifically designed for business desktops and notebooks: the Ryzen PRO 8000 series and the Ryzen PRO 8040 series. These APUs are built using a 4nm process and incorporate Zen 4 architecture, integrating Radeon RX 6400 graphics based on the RDNA 3 technology, and featuring the XDNA AI Engine to enhance AI processing capabilities. The Ryzen PRO 8000 series is positioned for desktop PCs, offering models such as the Ryzen 7 PRO 8700G with 8 cores and 16 threads, reaching speeds up to 5.1 GHz, and providing significant multitasking and energy efficiency for business applications like video conferencing. These APUs deliver robust security features in line with contemporary business standards.
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COUGAR FV270 Series: E-ATX Mid-Tower PC Cases with Pillarless Design

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Compucase Enterprise, under its COUGAR brand, has launched the FV270 series, a line of E-ATX compatible mid-tower PC cases, on April 15, 2024. This new series is noted for its pillarless design which features tempered glass extending from the front to the side panels, enhancing the visibility of the internal components. The unique curved structure with edge cuts offers expansive views inside the case. The FV270 models facilitate superior cooling options, accommodating up to nine fans with configurations including 120mm and 140mm on various sides, as well as water cooling radiators with capacities ranging from 140mm to 360mm in different positions. The airflow is designed to maximize efficiency by drawing air from the diagonal bottom and the side near the motherboard.
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Sony Prepares to Launch PlayStation 5 Pro with Advanced Graphics Capabilities

Published by Hilbert Hagedoorn 26

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Sony is set to introduce the PlayStation 5 Pro, codenamed "Trinity," potentially by late 2024. Recent leaks and insider reports reveal significant enhancements over the current PlayStation 5, particularly in graphics rendering. The PlayStation 5 Pro is designed to support advanced ray tracing features and achieve higher resolutions and frame rates, making it particularly appealing for developers and gamers aiming for peak visual performance. The new console will feature a more powerful GPU based on RDNA 3 architecture with 30 Workgroup Processors, capable of delivering 33.5 TeraFLOPS of FP32 single-precision compute power. This represents a roughly 45% increase in GPU rendering capabilities compared to the standard PS5. The CPU speed will also see a slight increase to 3.85 GHz, further enhancing game rendering capabilities.
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HyperX Introduces Alloy Rise Pioneer Series Gaming Mechanical Keyboards

Published by Hilbert Hagedoorn 1

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HyperX, an HP subsidiary, has introduced the Alloy Rise Pioneer series of gaming mechanical keyboards. The series includes two models: the full-size Pioneer RGB and the smaller 75% Pioneer 75. The starting price for these keyboards is approximately $174 USD.The Pioneer series keyboards are wired and feature a keyline separation design and a Gasket structure. Both models support hot-swapping of switches and have an 8000Hz polling rate. The keyboards also come with numerous customizable components, such as the aluminum top frame, side magnetic badges, and rotary media buttons, all of which can be replaced to suit user preferences. Focusing on the mechanical aspects, the Pioneer series utilizes HyperX's 2nd generation linear switches, which include a half-wall POM rod to enhance keycap stability. These switches are designed to withstand up to 80 million keystrokes. Additionally, they are factory pre-lubricated to improve performance. The actuation force of the HyperX linear switches is 40g, with a trigger travel of 1.8mm and a maximum travel of 4.0mm.
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Intel Arc A750 Graphics Card by BIOSTAR: Technical Specifications and Features

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BIOSTAR announced the release of the Intel Arc A750 OC graphics card on April 12, 2024. This new graphics card features a high-performance dual-fan cooler with a large diameter, designed to enhance cooling efficiency. The fans incorporate "Calm Technology," which allows them to stop rotating under low-load conditions, reducing noise and energy consumption. The Arc A750 OC is equipped with a robust power supply circuit that includes Dr.MOS and digital PWM technology, ensuring stable and efficient power delivery. The card's main specifications include 448 XMX engines and an engine clock speed of 2,200MHz. It also boasts a memory speed of 16Gbps and a 256-bit memory bus width, with 8GB of GDDR6 video memory.
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JONSBO Introduces New C6-ITX Mini-ITX Case with Four-Sided Mesh Panels

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Jonsbo also announced the release of the C6-ITX Mini-ITX case. This case features mesh panels on all four sides, designed for enhanced air circulation. Available in black and white, the C6-ITX allows for easy assembly and modification, as the panels can be attached and detached without the need for tools. The design also includes a belt-like handle atop the case, facilitating easier transportation. The C6-ITX accommodates various power supply units, supporting ATX power supplies up to 140mm in depth or smaller SFX types. It provides ample space for hardware, allowing for CPU coolers up to 170mm in height and graphics cards up to 255mm in length. The case includes one dual-purpose drive bay for 2.5-inch or 3.5-inch drives, three cooling fans (one 120mm fan each at the top, rear, and bottom—the latter dedicated to the drive bay), and four expansion slots.


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JONSBO Releases Enhanced M.2 SSD Cooler with Dual Heat Pipes and High-Speed Fan

Published by Hilbert Hagedoorn 1

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JONSBO unveiled its latest cooling solution for M.2 SSDs, designated as "M.2-7". This new product features an aluminum heat sink integrated with two direct-touch heat pipes, designed to enhance heat dissipation for high-performance NVMe M.2 SSDs, which are prone to significant heat generation during operation. The M.2-7 cooler is also equipped with a compact fan, measuring 25 x 25 x 10 mm, capable of reaching speeds up to 10,000 rpm. This fan setup is intended to provide efficient cooling by delivering a maximum air volume of 1.37 cubic feet per minute (CFM) and a maximum static pressure of 3.08 mmH2O. Despite its powerful performance, the cooler maintains a low noise level with a maximum of 25.9 decibels (dBA).
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KLEVV Introduces CRAS C925 M.2 Gen 4 NVMe SSDs with Enhanced Speeds and Capacities

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KLEVV has launched the CRAS C925 series, a new line of M.2 NVMe solid-state drives designed for the mid-range market. These SSDs are constructed in the M.2-2280 form-factor and utilize the PCI-Express 4.0 x4 interface. The series includes three models based on storage capacities: 500 GB, 1 TB, and 2 TB. The drives are engineered to achieve impressive performance levels, with sequential read speeds up to 7400 MB/s across all models. Sequential write speeds vary by model: up to 6200 MB/s for the 500 GB version, up to 6300 MB/s for the 1 TB version, and up to 6500 MB/s for the 2 TB version. In terms of random read and write operations, the 500 GB and 1 TB models can perform up to 670,000 and 980,000 IOPS, respectively, while the 2 TB model reaches up to 700,000 IOPS for reads and 1 million IOPS for writes.
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Confirmed again: Intel Arrow Lake Desktop Processors to Launch Without Hyper-Threading Technology

Published by Hilbert Hagedoorn 16

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Recent reports have unveiled that Intel's forthcoming Arrow Lake desktop processors, specifically the 20-core and 24-core models, will not include hyper-threading technology. This development was confirmed through the examination of startup log files for both processors, revealing that the number of cores directly matches the number of threads, thereby indicating the absence of hyper-threading. The 20-core model of the Arrow Lake series is anticipated to feature an 8 Performance-core (P-core) and 12 Efficiency-core (E-core) configuration, and is likely to be designated as part of the Core Ultra 7 200 series. Similarly, the 24-core variant is expected to include an 8P + 16E core arrangement and is projected to fall under the Core Ultra 9 200 series.
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Samsung to Release 290-layer 3D NAND in May 2024, Plans 430-layer Version by 2025

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Samsung is set to release its 9th Generation V-NAND technology in May 2024, featuring a 290-layer 3D NAND flash memory, according to a report by the Korean publication Hankyung. This new generation represents an advancement from the 236-layer 8th Generation V-NAND introduced in 2022. The increase in layers has been achieved through enhanced flash layer stacking techniques, which involve creating additional memory holes within each layer to improve vertical stacking density. While this technique reduces data density per wafer, it results in a net gain in overall layer count.
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Ongoing Melting Issues with NVIDIA RTX 4090 Graphics Cards: Repair Shops Manage 200 Units Monthly

Published by Hilbert Hagedoorn 89

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The NVIDIA RTX 4090 graphics card, launched in September 2022, continues to face serious issues with its power supply interface melting. NorthridgeFix, a GPU repair specialist, recently highlighted the persisting problem in a video that showcased a collection of damaged 16-pin power connectors from these cards. On average, the shop addresses malfunctions in 200 RTX 4090 units each month due to this defect. Originally, the RTX 4090 utilized a 12VHPWR connector, which has been prone to poor contact and subsequent melting. In response to the widespread issue, NVIDIA announced a transition to an improved 12V-2x6 power supply interface. Despite this upgrade, many units sold in the past two years still feature the older, problematic 12VHPWR connector.
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MINISFORUM V3 Launches: First AMD Ryzen7 8840U-Powered 3-in-1 Tablet with Advanced AI Capabilities

Published by Hilbert Hagedoorn 1

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MINISFORUM has initiated the pre-sale of its latest product, the V3, which is distinguished as the first 3-in-1 tablet equipped with the AMD Ryzen 7 8840U processor. This high-performance AI tablet integrates Radeon 780M integrated graphics and features a dual-fan, four-copper cooling system that supports a 28W sustained performance mode. This makes the V3 an ideal choice for intensive applications such as AI model training, graphic rendering, video editing, and gaming. The tablet is powered by the AMD Ryzen 7 8840U processor coupled with the XDNA AI processor, enhancing its neural processing unit (NPU) capabilities up to 16 TOPS and overall processor capabilities to 38 TOPS. This integration results in a Windows AI 3-in-1 tablet that meets Microsoft's highest security standards, supports real-time communication tools, and is compatible with Microsoft Copilot hardware.
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Antec Introduces Constellation C5 ARGB Middle Tower Case: Features and Specifications

Published by Hilbert Hagedoorn 0

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Antec's new Constellation C5 ARGB middle tower PC case seems nice. This case, designed without a central pillar to enhance accessibility and display aesthetics, supports a variety of motherboards with rear connectors, including ATX, MicroATX, and Mini-ITX. The case is available in two colors: black and white, with a scheduled release date of April 20, 2024. The estimated retail price is approximately $121 (19,480 yen including tax). The Constellation C5 ARGB case features tempered glass panels on the front and left sides, creating a visually appealing showcase for internal components. It accommodates extensive cooling options, including space for up to 10 120mm fans. Specific cooling capacities include three 120mm or two 140mm fans on the top, sides, and bottom, with additional single 120mm fan support at the rear. All provided fans are ARGB, enhancing the aesthetic with customizable lighting.
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ASUS preps ProArt Display PA32KCX: First 8K Mini LED Professional Monitor shown at NAB Show 2024

Published by Hilbert Hagedoorn 4

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ASUS has announced its participation in the NAB Show 2024 where it will preview the ProArt Display PA32KCX, touted as the first 8K Mini LED professional monitor in the world. This 32-inch monitor features an 8K resolution (7680 x 4320) and achieves a ΔE value of less than 1, indicating exceptionally high color accuracy. It covers 97% of the DCI-P3 color gamut, providing high color saturation suitable for cinema-level production. The ProArt Display PA32KCX is outfitted with a Mini LED backlight consisting of 4096 zones, delivering a peak brightness of up to 1200 nits and a sustained full-screen brightness of 1000 nits. This capability makes it well-suited for high dynamic range (HDR) content creation workflows.
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Western Digital Introduces 368TB Ultrastar Transporter Storage Device

Published by Hilbert Hagedoorn 9

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It almost feels like an Aprils fools joke but, Western Digital has introduced the Ultrastar Transporter, a high-capacity storage solution designed primarily for data transfer. The device incorporates a 368TB solid-state drive and has a variable weight of approximately 13 to 15 kilograms. This storage solution is particularly suitable for film crews and other field operations where slow network connections or high transmission costs impede data storage.
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