Intel marked a significant milestone today with the introduction of Intel 4 technology, featuring extreme ultraviolet (EUV) technology, marking the inaugural utilization of EUV in high-volume manufacturing (HVM) within Europe. This pivotal moment signals the future for Intel's forthcoming Intel Core Ultra processors, codenamed Meteor Lake, which will catalyze the development of AI-capable PCs.
MLID has disclosed two slides obtained from an internal AMD presentation originally intended for internal use. These slides offer insights into the progress and strategies concerning the upcoming Zen architectures of the next generation. They divulge crucial details such as anticipated IPC enhancements, supported functionalities, and core quantities.
Yingren Technology's (the company behind innogrit) YR S900 PCIe 5.0 SSD controller has commenced mass production, signifying a notable achievement in the realm of domestic enterprise-level PCIe 5.0 main control chips.
The Revolt 3 has a compact vertical structure, taking up only 18.4 liters of space, making it a viable choice for users with limited desk space. This design doesn't compromise component compatibility. Built with this case, MAINGEAR's Revolt series gaming PCs are designed for portability, evident with the integrated handle.
JONSBO has unveiled the "TK-1 2.0," a MicroATX-compatible mini tower PC case featuring a pillarless design and curved tempered glass side panels in Black and White variants. This updated version of the original "TK-1," initially released in February, maintains its appealing aesthetics while incorporating improvements to the drive bay.
MINISFORUM, headquartered in Hong Kong, has unveiled the "Minisforum V3," a 2-in-1 Windows tablet featuring AMD's upcoming processor, known as "Hawk Point." Scheduled for release as part of the Ryzen 8000 series, this tablet boasts a generous 14-inch LCD display with QHD+ resolution and an impressive 165Hz refresh rate. It also supports precise pen input with 4,096 levels of pressure sensitivity.
TSMC today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum. The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration.
Meta has announced the upcoming release of its Meta Quest 3, a mixed reality headset, slated for October 10. Pre-orders for the device have begun, with pricing set at $499.99 USD for the 128 GB variant and $649.99 USD for the 512 GB model. Additionally, the Meta Quest 3 will be bundled with "Asgard's Wrath 2" for a promotional period. The 512 GB version also offers a six-month trial of Meta Quest+.