Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced several new quad channel DDR3 memory kits optimized for motherboards using the Intel Core i7 processor family for Socket LGA-2011.

After announcing the world's first high-performance quad channel 32GB memory kit in October, Corsair is following up with the addition of three new quad channel memory kits. Like all Dominator memory kits, the new kits are assembled with tightly screened DRAM and include Corsair's DHX+ heatsink patented technology. All Dominator quad channel kits support Intel's latest XMP 1.3 profiles for easy performance tuning.

Used in our reference review with the MSI board G.Skill has announced the development of its brand new RipjawsZ series quad-channel memory modules, designed specifically for Intel LGA2011 Sandy Bridge-E processors and X79 systems.

A World First in Super-Sized & Super-Speed, the new RipjawsZ builds on a history of Ripjaws world first performance boundaries and award-winning quality, by including extreme performance kits such as, DDR3 2,500MHz 16GB (4GBx4) 1.65V kit, and super size kits including DDR3 64GB (8GBx8) 2133MHz at only 1.5V, and the fastest ever 8GB DIMMs in the DDR3 2,400MHz 32GB(8GBx4) kit. The following screens show two RipjawsZ 2,400MHz 32GB(8GBx4) kits running together at 2400MHz 64GB and booting at breath-taking 2600MHz 64GB with ASUS Rampage IV Extreme motherboard.

One thing that most X79 boards don't have is support for Bluetooth 4.0 and 802.11n Wi-Fi, its reported that that Gigabyte figured it would just make an add-in-board to make up for the deficit, which is really more of a PC Express to mini PCI Express adapter.

A half-sized mini PCI Express card based on an Atheros processor was equipped with an USB pin-header, meant to be attached to the USB pin-header on the motherboard.

With this to make sure the Bluetooth 4.0 connection works, the WiFi side of the equation will be left with the PCI Express connection. ECS already tried to solve this 'issue' as well, the solution involving a PCB antenna hardwired to the rear I/O, among other things.

Also, ASUS tried for a proprietary raiser card for the P9X79 Deluxe (with custom designed USB devices, apparently). Compared to those, Gigabyte's method seems somewhat more simple, even though it is limited to 150Mbps Wi-Fi (it has only two antennas). As such, no MIMO support exists (needs 300 Mbps).

The X79-UD5, X79-UD7 and G1.Assassin 2 motherboards are the ones that will ship in a bundle with the PCI Express card. Not certain if the item will sell standalone as well, but there is no reason it shouldn't.

Team Group revealed new DDR3 kits. Press release is printed below, full specifications of each module can be found over here.

Team Group Inc.?fs memory modules have always been known for its stability and high performance among enthusiasts. In 2011, the company invests heavily to build the new Xtreem series radiating modules, and changes the packaging to a smaller volume of paper card design that is more environmental friendly. Enthusiasts would be guaranteed to enjoy the ultimate feeling of freshness and classic at the same time.

• Mainstream Team Xtreem Dark?|Steady and eye-catching
  The Team Xtreem Dark series target the consumer market, and uses memory particles rigorously selected and tested by Team Group Inc. The new heat-sink has better cooling efficacy, which can speed up the dispersion of the heat generated by the particles more evenly and effectively. It can also speed up the circulation of cool and hot air within the case to reach a heat balance in the shortest amount of time to guarantee the most stable operating environment.
• Performance Team Xtreem LV?|Extreme speed
  The new version of Team Xtreem LV packaging exerts Team Group?fs proud X cooling technology to the most, bringing enthusiasts an extreme performance. The X totem maximizes the cooling fin area, and when compared to ordinary over-clocking memory modules, the new Xtreem has a lower operating temperature that would satisfy enthusiasts?f pursuit of extreme over-clocking performance.
  

Consumers don't have any reason to feel bad about low memory prices, but the makers of DRAM do, though they might finally be able to risk a hope, albeit a small one softpedia reports:

The past year saw DRAM prices fall almost constantly, with the few episodes of rebound far between and just enough to torment memory makers with false hopes that were invariably crushed not much later.

Cumulatively, prices of memory have fallen by roughly 50% since the start of the ongoing year (2011).

This was a direct result of the poor demand on the part of consumers, as well as of overstocked inventories due to rapid advancement to better manufacturing processes.

The fourth and final quarter of the year has arrived, however, and with it some hope, though a very faint one, to put it mildly.

Apparently, during the first half of October, DRAM prices managed not to go any lower, though staying flat wasn't an overly large improvement either.

Still, at least there is one shred of evidence that memory chips could reach some price stability, though there is also every bit of possibility that this is just another temporary reprieve.

The world economy is not doing much better than at the start of the year after all, and even China's National Day holiday went by without any spike in PC shipments.

DRAM makers cut supply a while ago and will go on producing less for some time yet, unsurprisingly.

The one glimmer of hope that exists now is that ultrabooks will sell well, taking random access memory module sales levels (and, by extension, DRAM chip shipments) upward again.

For those who want numbers, 2 GB DDR3 modules slid down 2%, selling for about $10.50 (7.64 Euro) while 4 GB, the new mainstream now, stuck to $19-20 (13.83

Corsair announced a high-performance quad channel Dominator 32GB DDR3 memory kit.

The Dominator 32GB Quad Channel kit (part number CMT32GX3M4X1866C9) consists of four rigorously-screened 8GB DDR3 DRAM modules with Corsair’s patented DHX+ heatsinks. It operates at 1.5V and is designed to run at 1866MHz, with 9-10-9-27 C9 timing. Corsair has compatibility tested the new 32GB Quad Channel kit with upcoming quad channel platforms as well as current dual channel platforms.

"The new Dominator 32GB Quad Channel memory kit is designed for high-performance PC enthusiasts using the latest motherboards, whether they're overclockers, gamers, or simply want a large amount of state-of-the-art memory," said Thi La, Vice President of Memory Products at Corsair. "Corsair is a market leader in high-performance memory, and we're pleased to be first to market with a high-performance 32GB quad channel kit."

The Dominator 32GB Quad Channel kit will be available in October from authorized Corsair retailers and etailers worldwide for a US MSRP of $999. To get the full story on Corsair’s complete line of high-performance Dominator DDR3 memory kits, please visit.

Corsair introduced its first 8GB DDR3 memory modules. There's a 8GB Vengeance module that runs at 1600MHz with 10-10-10-27 timings at 1.5V, and also a 8GB Value Select edition that runs at 1333MHz with 9-9-9-24 timings at 1.5V.
Corsair Vengeance: High Performance and Overclockability
The new 8GB Vengeance DDR3 memory operates at 1.5V for compatibility with the new 2nd generation Intel

Toshiba today announced that it will launch the world's first SDHC memory card with embedded wireless LAN functionality to meet the SD Memory Card Standard. The new card, "FlashAir", has an 8GB capacity and supports both peer-to-peer transfers and uploads to and downloads from servers. Samples will be available from November 2011 and sales will start in February 2012.

At a time when digital cameras have achieved immense popularity, users want a quick and easy way to share photographs with friends and to transfer them to and from online storage services and social networks. Toshiba provides the solution with FlashAir, the world's first SDHC memory card with embedded wireless LAN functionality that is fully compliant with the SD Memory Card Standard.

FlashAir's embedded wireless communication function allows users to upload and download photographs to and from a server and to exchange photographs and other data with other devices, including digital cameras that are FlashAir compliant and, smartphones and PCs that support wireless LAN. All transfers are done wirelessly, without any need for a cable connection. Key features of the new card include the ability to receive as well as transmit and lower power consumption than other cards with similar functions.

Even in digital cameras not compliant with FlashAir, the new card can share digital images with smart phones and PCs that support wireless LAN.

Toshiba will secure certification of FlashAir for wireless communication in Japan, North America and Europe.

Germany based Caseking announced the availability of four DDR3 memory lines from Avexir; Green, Budget, Standard and Blitz.

Avexir may be an unknown brand in these areas of the world, but is already present in the market since 2006. The products of the memory specialist are available immediately at Caseking. The assortment currently consists of four series - the

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced selected key attributes of its widely-anticipated DDR4 (Double Data Rate 4) standard. With publication forecasted for mid-2012, JEDEC DDR4 will represent a significant advancement in performance with reduced power usage as compared to previous generation technologies. When published, the new standard will be available for free download at www.jedec.org.

DDR4 is being developed with a range of innovative features designed to enable high speed operation and broad applicability in a variety of applications including servers, laptops, desktop PCs and consumer products. Its speed, voltage and architecture are all being defined with the goal of simplifying migration and facilitating adoption of the standard.

A DDR4 voltage roadmap has been proposed that will facilitate customer migration by holding VDDQ constant at 1.2V and allowing for a future reduction in the VDD supply voltage. Understanding that enhancements in technology will occur over time, DDR4 will help protect against technology obsolescence by keeping the I/O voltage stable.

The per-pin data rates, over time, will be 1.6 giga transfers per second to an initial maximum objective of 3.2 giga transfers per second. With DDR3 exceeding its expected peak of 1.6 GT/s, it is likely that higher performance levels will be proposed for DDR4 in the future. Other performance features planned for inclusion in the standard are a pseudo open drain interface on the DQ bus, a geardown mode for 2667 Mhz data rates and beyond, bank group architecture, internally generated VrefDQ and improved training modes.

The DDR4 architecture is an 8n prefetch with bank groups, including the use of two or four selectable bank groups. This will permit the DDR4 memory devices to have separate activation, read, write or refresh operations underway in each of the unique bank groups. This concept will improve overall memory efficiency and bandwidth, especially when small memory granularities are used.

Additional features in development include:

• Three data width offerings: x4, x8 and x16
• New JEDEC POD12 interface standard for DDR4 (1.2V)
• Differential signaling for the clock and strobes
• New termination scheme versus prior DDR versions: In DDR4, the DQ bus shifts termination to VDDQ, which should remain stable even if the VDD voltage is reduced over time.
• Nominal and dynamic ODT: Improvements to the ODT protocol and a new Park Mode allow for a nominal termination and dynamic write termination without having to drive the ODT pin
• Burst length of 8 and burst chop of 4
• Data masking
• DBI: to help reduce power consumption and improve data signal integrity, this feature informs the DRAM as to whether the true or inverted data should be stored
• New CRC for data bus: Enabling error detection capability for data transfers
  

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.

Samsung

Well now, AMD expanded their product line with apparantly memory modules. New and quietly introduced are AMD Radeon DDR3 memory for systems, the Entertainment memory is already for sale in Japenese stores:

AMD Radeon

Mach Xtreme revealed the fancy colored Urban dual-channel DDR3 kits.

Mach Xtreme Technology Inc., a worldwide leader in top performance, high reliability and user-friendly designed PC components, today unveiled Urban

The Special Edition Arctic White Vengeance LP memory operates at a 1.35V and is ideal for ultra-quiet systems and other low-voltage applications. It consists of two rigorously-screened 4GB DDR3 DRAM modules, guaranteed to operate at 1600MHz with a tested latency of 9-9-9-24. The Vengeance low-profile heat spreader has a reduced height of 1.03

Oh lordy, it's useless as they haev been LN2 cooled .. but still a great achievement. Kingston has recently announced that its HyperX memory has broken two world records.

The results were achieved using Kingston's fastest dual-channel memory kit to date, the HyperX 2544MHz which requires 1.65V to work at its maximum rated speed with 9-11-10-31 timings.

In order to push this beyond its factory frequencies, overclockers Benjamin Bouix aka

VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced its latest USB 3.0 device controller, the VIA Labs VL751 SuperSpeed USB to NAND flash controller. The VL751 is VIA Labs' second-generation single-chip solution for USB 3.0 flash drives, and offers enhanced performance using today's popular flash memories. The VIA Labs VL751 has been certified by the USB Implementers Forum (USB-IF) for SuperSpeed operation, ensuring high quality, seamless interoperability, and effortless backwards compatibility.

The VIA Labs VL751 features a four-channel NAND interface, doubling or even quadrupling maximum throughput over single or dual-channel designs. The second generation VIA Labs VL751 offers improved parallelization and higher efficiency through integrated pre-read and pre-write buffers, better support for popular flash memories, and a pipelined ECC engine. Cumulatively, these enhancements translate into a nearly 100% performance boost over the VIA Labs VL750 with no increase in power consumption.

"With USB 3.0 functionality being integrated into next-generation chipsets, virtually all new desktops and laptops will have USB 3.0 by early next year" said David Hsu, Associate Vice President, VIA Labs, Inc. "The VIA Labs VL751 will be important in the general broadening of the USB 3.0 ecosystem by allowing fast, large capacity flash drives of 32gb or more to be readily available and more affordable than ever."

VIA Labs VL751 USB 3.0 to NAND Flash Controller
The VIA Labs VL751 features USB mass storage class 'Bulk-Only Transport' for universal compatibility across platforms such as Windows, Mac OSX, and Linux without the need for additional drivers. Featuring a 4-channel memory controller with interleaving support, blistering fast data transfer speeds of 120MB/s or more are within reach. VIA Labs VL751 is fully compliant with the USB 3.0 specification, and is also backwards compatible with USB 2.0 and 1.1 standards, offering class-leading performance in USB 2.0 mode with transfer speeds of up to 35 MB/s.

In addition to high performance, the VIA Labs VL751 is also designed for ease of implementation and support. Powered by advanced in-house PHYs, VIA Labs VL751 is a single-chip solution that offers outstanding signal integrity characteristics while supporting popular 2X-3X nm flash memories.

Corsair announced availability in limited quantities of a new 1.5V 8GB Dominator GT DDR3 memory kit with an aggressive timing specification.

The new 8GB dual-channel DDR3 kit is guaranteed to operate at 2133MHz at a memory voltage of 1.5V, and with a groundbreaking timing specification of CL9-11-9. With latency settings this low, the Dominator GT modules have the most aggressive timing specification of any 2x4GB 21333MHz 1.5V memory kit available today.

The new hand-assembled Dominator GT memory kit is the product of a multi-stage component screening process in which individual memory ICs are screened before assembly onto the PCBs, which then undergo additional rigorous testing to ensure reliable performance. Qualification is performed on Intel® P67 and P55 motherboards, using the same rigorous test cycle applied to the rest of Corsair's memory product lines. As with all Corsair memory products, Dominator GT is backed by a limited lifetime warranty.

"The unprecedented timing specification on the 1.5V Dominator GT kit makes it ideal for overclocking," said Giovanni Sena, Director of Memory Products at Corsair. "Dominator GT memory is designed for enthusiasts who are obsessed with pushing their PC's performance to the limit, and this latest kit is a worthy addition to the family."

The 1.5V 8GB Dominator GT (CMT8GX3M2A2133C9) DDR3 memory kit comes complete with Corsair's patented DHX+ heatsinks and an AirFlow 2 GTL Cooling Fan for exceptional thermal performance. It may be purchased directly from Corsair.com for $499 USD. Limited quantities are available. For more information on this and other Corsair Dominator memory products, please visit the Corsair web site.

GeIL introduced new Enhance Corsa and Evo Corsa DDR3 memory kits, Corsa is geard for overclockers, consisting of DDR3-1866 MHz and DDR3-2133 MHz kits. The modules are put through rigorous testing to make them tolerant to high DRAM voltages and extended operation under high voltages, making them perfect for high 24x7 overclock scenarios.

All kits in this series are packed with memory timings of 9-10-9-28, and DRAM voltage of 1.5V. Like with Enhance Corsa, this series consists of 2x 2GB, 2x 4GB, 4x 2GB, and 4x 4GB kits. GeIL did not give out pricing and availability information.

Early July contract prices for 2GB and 4GB DDR3 memory modules declined another 7% following about 6% decreases in late June, according to data collected by DRAMeXchange. Prices have come near the low levels reached during the previous industry downturn, the price tracker observed.

As chip producers are under growing pressure to clear out their inventories, PC OEMs have gained more bargaining power when negotiating prices, DRAMeXchange pointed out.

In addition, DRAM inventory at PC OEMs had piled up earlier in the second quarter, which thus discouraged them to place orders starting June, DRAMeXchange indicated. But the average inventory level at PC OEMs has slid to 4-6 weeks after recent corrections, DRAMeXchange added.

Contract prices for late July may continue to fall as OEM clients remain reluctant to place orders, DRAMeXchange said.

Early July contract prices for 2GB and 4GB DDR3 modules averaged US$16 and US$31, respectively, down 7.25% and 7.46%, according to DRAMeXchange. Prices for corresponding 1Gb and 2Gb chips were US$0.84 and US$1.78, respectively.

ADATA introduced the single DDR3L 1333G 8GB XPG Gaming Series memory.  In an industry first, the company has launched the single 8GB XPG