G.SKILL is showing extreme dual channel memory kits, DDR3 2133MHz 32GB (4x8GB), compatible with the latest Z77 motherboards at CeBIT 2012.

Working closely with leading motherboard manufacturers, G.Skill is ready to provide PC enthusiasts the best dual channel memory for the upcoming Z77 motherboards. On the MSI Z77A-GD65 and ASRock Z77 Extreme6 motherboards, G.Skill has demonstrated the 32GB super size memory kits at DDR3 2133MHz ultra high speed with Intel Core i7 2600K processors.

On 27th February 2012, the highest DDR3 memory frequency record was smashed again by the well-known Swiss overclocker, Christian Ney. Using G.SKILL extreme RipjawsZ memory kit, Christian Ney has achieved the astonishing score of DDR3 3736MHz with 4GB high capacity memory stick.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, once again achieves a breakthrough in overclocking memory specifications with the launch of single 8GB 1600MHz CL9 and dual kit 16GB memory modules. As a market solution for 1600 MHz 8 GB low latency overclocking, the new modules support the latest quad-channel X79 platform, and meet the demands of enthusiasts for high density memory.

ADATA's Product Planning Department DRAM Project Manager Alex Wu said: "In recent years, gamers and overclockers care about more than just the pursuit of extreme performance. Energy consumption has become a major consideration when purchasing electronics." He added: "The new XPG Gaming V 2.0 1600G 8 GB single and 16GB dual kit memory modules use voltage of only 1.35V, with 9-11-9-27 timing, and are compatible with the latest X79 four-channel platform. They provide gamers with the opportunity to significantly upgrade their RAM all the way to 64 GB, in order to experience faster operation and performance of desktop computers."

In addition to high density, low-latency, low-voltage, and innovative heat conduction cooling technology, these modules are equipped with a unique heat sink and the industry's first high quality double copper 8-layer circuit board, which improves memory cooling and lowers power consumption. In addition, each chip is selected from original manufacturer 4 Gb memory chips, and put through a rigorous screening and testing program to ensure the greatest degree of stability and durability, for more peace of mind for consumers.

ADATA Series memory modules come with a lifetime warranty, providing the best protection and peace of mind.

Elpida Memory has filed for bankruptcy protection today, as the firm is unable to refinance its heavy debt. It's the largest Japanese manufacturing corporate failure since World War II, the company has a debt of $5.5 billion and a DRAM marketshare of 12.5 percent.

Elpida decided to separate the low margin PC business to its Taiwanese subsidiary and concentrate instead on higher ASP devices for smartphones after the financial crisis. Yukio Sakamoto, Elpida

DDR4, the next DRAM memory standard, is expected to be massively adopted by 2014, which means that the companies behind its existence have to start showing prototypes now instead of later. It so happens that the International Solid-State Circuits Conference (ISSCC) has just taken place (between February 19 and 23) as softpedia reports today:

The conference was the perfect occasion for revealing next-generation dynamic random access memory (DRAM) chips.

TechEye reports that two companies were willing to show off their inventions. Hynix is one of the companies with a DDR4 device. The chip works at 2400MHz (2400Mb/s) and needs a voltage of 1.2V. It bears a 64-bit I/O.

The second company to bring out a DDR4 product was Samsung. The clock frequency was of 2,133 MHz and the voltage was the same as above.  Hynix used its 38nm manufacturing process technology, while Samsung employed the 30nm node instead.

For the sake of comparison, DDR3 needs 1.3V or 1.5V to run, even if the manufacturing process is the same.

All in all, DDR4 modules are going to be not just faster, but also energy efficient, by about 40% compared to their predecessors. They won't be pin-compatible though. Elpida, Micron and Nanya did not show DDR4 prototypes at the show, for one reason or another. There is no real rush, though, since the chips and modules aren't going to be available for a while still. Volume production will only commence in 2013, which means that mass availability is something that 2014 will bring at the earliest.

Until then, memory companies will have to deal with more pressing matters, like the low market prices of all DRAM chips and how consumers, while not at all disapproving, don't seem to be responding with much enthusiasm either. Granted, contract quotes are going up little by little now, but there is no guarantee that this trend will last.

G.Skill has announced the brand new Ares series low profile performance DDR3 memory. Featured with low profile heat spreader design (3.2cm in height), G.Skill Ares series DDR3 memory modules are the perfect choices for building high performance PCs with large CPU coolers, small form factor desktop computers or any other systems with more restricted space.

Every Ares memory kit is hand-tested with G.Skill rigorous internal validation process to ensure the maximum stability and compatibility with both Intel and AMD platforms.

Compliant with the latest Intel XMP (Extreme Memory Profile) function, G.Skill Ares series DDR3 memory provides PC enthusiasts and extreme gamers a trouble free overclocking experience on Intel platforms, while enjoying the enhanced memory bandwidth. G.Skill Ares specifications are listed as below. Specifications are subject to change without notice.

Super Talent introduced new quad-channel DDR3 memory with clockspeeds of 1600MHz and 1866MHz. You can get it as 4GB modules or in 16GB kits.

Super Talent Technology, a leading manufacturer of NAND flash solutions, today announces their Quadra series, overclocked, quad-channel DDR3 memory kits, targeted at the extreme enthusiast market.

Gamers and enthusiasts already know about Intel

ADATA today introduced new industry-leading, single piece 8GB DDR3-1600 high-density memory modules. Known for industry-high standards of quality control and meticulous device engineering, the new modules will meet and exceed expectations of customers who seek performance and quality in DRAM products.

With this launch ADATA is continuing its tradition as an industry leader in DRAM product line-up. These 8GB Premier Series DDR3-1600 single piece memory modules allow users to boost system performance over the limitations of memory slot availability. 

The Premier Series 1600Mbps DDR3 240-Pin (Unbuffered DIMM) are standard pin design modules operating at 1.5 volts, with bandwidth up to 12.8 Gb/second (PC3 12800). The memory modules are made of cutting edge high density 4Gb DRAM, so they operate faster, consume less power, and hence operate at cooler temperatures. All the modules are in accordance with JEDEC (Joint Electron Device Engineering Council, JEDEC Solid State Technology Association) and RoHS design and production standards, simultaneously ensuring compatibility with all computer systems adopting the same standard, and are ecologically sound products. ADATA Series memory modules come with lifetime warranty and service1, providing consumers the best protection.

Product Features

• 8GB 
• 240-Pin Unbuffered DIMM / 204-Pin SO-DIMM
• JEDEC DDR3-1600 compliance and also compatible with DDR3-1333 and lower frequency operations
• RoHS compliant

The new series of DDR3 quad channel overclocking module from KINGMAX is designed for optimizing the maximum performance on X79 related motherboard. The main clock rate of this series is set as 1333 MHz, but it is also available in 1600MHz, 2000MHz and 2200MHz. Intel X79 is an upgrade from the previous X58 series, thus building on the X79 platform means KINGMAX

Team Group introduced quad-channel DDR3 2600MHz kits, they are available in 8GB and 16GB capacities. Timings are 10-12-12-31 1T at a voltage of 1.65V.

The global leading brand Team Group Inc. takes the lead again by launching the Xtreem LV DDR3 2600 Quad-Channel CL10 for top specification, yet again dropping another bomb in the of OC memory market.

As its previous Xtreem LV DDR3 2400 CL9 has won overwhelming compliments, the company gets the chance again to bring out the upgraded Xtreem LV DDR3 2600 Quad-Channel CL10. This limited edition is by far the fastest and the only manufacturer to meet the extremely high standards of the 1T Command rate in the market. Its efficiency is 10% better than any other Quad-Channel memory. In addition, it supports the latest Intel X79 flagship platform and adopts the new Intel Core i7 premium processor Sandy Bridge-E (LGA-2011). The excellent stability and compatibility have passed strict tests to satisfy overclocking players

Crucial announced the immediate availability of 8 GB DDR3 memory modules across the Crucial Ballistix Sport, Tactical, and Elite series. By taking advantage of Micron's 4 Gb DRAM technology, the new 8 GB modules provide users with the maximum capacity, performance, and density needed to run data-and graphic-intensive applications smoothly and efficiently.

Available in low-latency DDR3-1600 MHz and DDR3-1866 MHz modules, Crucial 8 GB Ballistix modules can be installed in configurations up to 64 GB in some systems, including the new Intel X79 platforms. Additionally, the complete line of Ballistix memory features a new logo treatment and updated heat spreader designs.

Ballistix Sport
The new Crucial Ballistix Sport 8 GB DDR3-1600 MHz memory module is designed to provide mainstream users and general PC enthusiasts with an affordable, reliable, no-hassle gaming experience. The Crucial Ballistix Sport series offers timing and voltages for maximum memory stability and system compatibility.

Ballistix Tactical
Well-suited for gamers, power users, and performance enthusiasts, the new Crucial Ballistix Tactical 8 GB DDR3-1600 MHz memory has lower latencies and features the Intel Extreme Memory Profile (XMP) which enables easy setup. The Crucial Ballistix Tactical series provides high speeds and features a black PCB and enhanced heat spreader design for improved thermal performance.

Ballistix Elite
Designed for extreme overclockers and advanced users, the new Crucial Ballistix Elite 8 GB DDR3-1866 MHz memory utilizes Intel XMP, and features a thermally efficient extruded aluminum heat spreader design, black PCBs, and integrated thermal sensors for real-time monitoring of temperature utilizing the Ballistix Memory Overview Display (M.O.D.) utility.

Crucial Ballistix memory is backed by a limited lifetime warranty and is rigorously tested to meet or exceed the high-quality performance specifications customers have come to expect from Crucial. Crucial Ballistix Sport, Tactical, and Elite memory modules are available now through select global channel partners, or directly at www.crucial.com.

VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced its proprietary USB2Expressway Dedicated Bandwidth Technology for USB 3.0 Hubs which dramatically improves USB 2.0 performance when multiple devices are utilized. USB 3.0 Hubs featuring the technology eliminate USB 2.0 bandwidth limitations by providing full, dedicated bandwidth per port, allowing multiple USB 2.0 devices to be connected and operated at their maximum capabilities.

USB 2.0 provides 30-40MB/s of actual throughput, and this is shared across all connected devices. When multiple devices such as external hard drives, flash drives, and webcams are connected, they share available bandwidth which results in severely degraded performance. Compared to USB 2.0, USB 3.0 offers 10x more bandwidth and allows transfers as fast as 300-400MB/s. VIA Labs USB2 Expressway Dedicated Bandwidth Technology allows USB 2.0 devices to utilize USB 3.0 bandwidth, eliminating bandwidth bottlenecks and freeing each connected device to reach its maximum performance potential.

"VIA Labs unveiled the world

This would be an interesting move in the memory arena, X-bit Labs writes Elpida may try to merge with Toshiba or Micron to ensure its survival.

In a bid to survive on the market of dynamic random access memory, Elpida Memory, which has to pay over $1.4 billion in April, 2012, the company may try to merge with its rivals. A possible combination will include Elpida, Micron and Toshiba, which has all chances to become the largest DRAM makers in the world, according to DRAMeXchange, a division of TrendForce.

Heading into the end of 2011, Elpida

The idea behind 3DS is to use specially designed and manufactured master-and-slave DRAM die, with only the master die interfacing with the external memory controller. 3DS technology uses optimized DRAM die, single DLL per stack, reduced active logic, single shared external I/O, improved timing, and reduced load to the external world. This combination of features can improve timing, bus speeds, and signal integrity while lowering both power consumption and system overhead for next-generation modules, according to Micron.

In its video demo, Micron shows a timing limitation when reading from one rank and then from another. Due to the system limitation, there is a one-cycle gap on the data bus, which impacts overall system bandwidth. Micron

If you need some memory supersized .. look no further. G.Skill has once again pushed the DDR3 memory performance to the boundary, and successfully developed the super sized & super speed DDR3 2400MHz CL10 64GB(8GBx8) kit, exclusively for Intel X79 platform. 

Every single memory module of this 2400MHz 64GB kit is hand-tested, hand-picked by G.Skill's R&D team. All the chips are highly selected and tested with G.Skill rigorous internal validation process to ensure the maximum stability, while maintaining a decent overclocking headroom. The following screen shows the super kit under memtest burning test with ASUS Rampage 4 Extreme motherboard and Intel 3960K processor.

G.Skill's new quad-channel kit is backed by a lifetime warranty.

Corsair introduced Vengeance laptop memory upgrades. Corsair

We made mention of this months ago already, but AMD outted their Radeon branded memory line in a press-release.

AMD today announced North American retail availability of the first AMD Memory branded desktop system memory modules, debuting with partners Patriot Memory LLC and VisionTek Products, LLC. AMD Memory branded products will help take the guesswork out of DRAM selection, providing an easy and straightforward experience when looking for the ideal match for gaming or multimedia PC needs.

As part of AMD

Corsair announced that it has set a new world record with a memory frequency of 1733.8MHz (DDR3-3467) using Corsair Dominator GT CMGTX6 extreme-performance DDR3 memory.

World champion overclocker and Corsair employee Jake "Planet" Crimmins set the new record at Corsair's laboratory with a custom-designed, liquid nitrogen cooled PC based on an AMD FX-8150 processor and equipped with 1GB of Dominator GT extreme-performance DDR3 memory. The system was powered by a Corsair Professional Series Gold AX1200 fully modular power supply.

"Breaking overclocking world records requires skill, ingenuity, and the right equipment," said Jake Crimmins. "I've broken several records using Dominator GT memory. It's reliable, it has amazing headroom, and it's never let me down." Validation can be found here, and details of the record here.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced a range of HyperX Genesis memory in 8GB, 16GB and 32GB kits to support the new Intel Sandy Bridge-E X79 quad-channel processors and X79 Express-based motherboards. Kingston HyperX Genesis is the perfect solution for enthusiasts who require 4x raw performance increases afforded by quad channel over single channel solutions.

For extreme users who require both the fastest memory and largest capacity, Kingston's 2400MHz and 2133MHz will soon be available in both 8 GB and 16 GB kits of four modules. Other HyperX Genesis memory for X79 systems include 1866 MHz and 1600 MHz frequencies in kits of four and eight, with capacities ranging from 8GB to 32GB. All of Kingston's HyperX kits have achieved Intel XMP certification and are compatible with the latest X79 motherboards from vendors such as ASUS, GIGABYTE, MSI and ASRock.

"Our latest HyperX offerings are specifically made to maximize performance in Intel's new Core i7-3960X or 3930K processors with quad-channel memory support," said Mark Tekunoff, senior technology manager, Kingston. "HyperX Genesis for the X79 platform will scale new overclocking heights for extreme gamers, benchmarkers, content creators and enthusiasts."

Mach Xtreme launches quad-channel Urban DDR3 for Intel's Sandy Bridge-E. Mach Xtreme Technology Inc., a worldwide leader in top performance, high reliability and user-friendly designed PC components, today unveiled Urban Series Quad-Channel DDR3 memory kits giving demanding enthusiasts exactly what they need. The kits are optimized for Intel X79 express chipset based motherboards.

Urban quad-channel DDR3 modules offer desktop users groundbreaking computing experience at an attractive price point. Featuring enhanced capacity of 4GB per module, these new high-density 16GB kits provide customers with cutting-edge memory solution that significantly increases memory space driving breakthrough gaming and digital media content creation performance of X79 based systems. Each kit is designed to work as a kit and users working with the latest operating system can keep multiple applications open or run smoothly memory intensive graphic programs. The uniquely designed lightweight heatsink is made of specially imported top grade Japanese aluminum.

Each module is 100% hand-tested for quality assurance and is backed by lifetime warranty. Coupled with an attractive price, the Urban 16GB kits are an excellent choice for your X79 upgrade.

Urban Series High-Density Quad-Channel DDR3 Memory Kits at A Glance:

• 1333MHz Quad-Channel DDR3
• Voltage 1.5V
• Density 16GB (4GB x4)
• Patented High-quality Japanese Lightweight Aluminum Heat-sink
• Certification: ROHS, WEEE, CE, FCC
• Models: MXD3U133316GQ @ 1333MHz (CL 9)
• Warranty: Lifetime