Just when you think it can't be cheaper ... it will be. DRAMeXchange reports the DRAM market is slowing down again, as prices of 4GB DDR3 modules have fallen close to the lowest price reached during the second half of 2011. Dynamic random access memory (DRAM) market monitoring company DRAMeXchange claims that as notebook shipments show signs of weakening and Windows 8 looks unlikely to stimulate PC shipments, second-half September contract price continues on a downtrend.
JEDEC announced it has finalized the DDR4 memory standard. The first DDR4 memory modules for servers are anticipated next year, but widespread adoption among consumers isn't anticipated until 2015.JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the initial publication of its widely-anticipated Synchronous DDR4 (Double Data Rate 4) standard.
Samsung announces mass production of the eMMC Pro Class 1500 flash storage memory for mobile phones and tablets. This new memory is four times faster than previous eMMC solutions. Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has now begun volume production of an ultra-fast embedded memory for smartphones, tablets and other mobile devices in 16-, 32- and 64-gigabyte (GB) densities.
Elitegroup Computer Systems (ECS) today announces that it is the first hardware manufacturer to support the latest AMD Memory Profile (AMP) on its innovative platform: A85F2-A Deluxe motherboard. It has been ready to take full advantage of the performance, high end gaming, multi-tasking and energy efficiency with the most anticipating technology ?gAMP?h, allowing users to fully satisfy their growing demand with its unique operating designed.
With striving on Research and Development and also closely cooperation with AMD, ECS is honored to become the first AMD Memory Profile (AMP) certified motherboard vendor in the world. The upcoming AMD Memory Profile (AMP) not only breaks through the traditional design, it also enables the performance tuning of DDR3 memory modules beyond standard JEDEC (Joint Electron Devices Engineering Council) specification.
AMP features a wide range of enhancements, reliability and perfectly performance, which are certified DDR3 Plug & Play memory modules. The latest AMD Memory Profile (AMP) provides a new experience to users in order to unleash the maximum memory performance.
A innovation leading company ?| ECS, is the first company announce to import AMD Memory Profile (AMP) into product. ECS not only provides integrated solution for supporting, but also considers customers?f needs as the core consideration for the products design, and the customer-oriented design concept has been the power for its self-progression. Making a unique and glory prominent product is the only purpose for ECS.
ADATA Technology Co., Ltd. today announced the start of shipments of the XPG Gaming v2.0 Series DDR3 2400G DRAM modules. These dual channel kits are designed and engineered to bring optimum performance to third generation Intel Core processors and the Z77 platform.
XPG DRAM modules signify Xtreme Performance Gear, providing the extreme speed and performance required by advanced users. The XPG Gaming series v2.0 is targeted specifically at the distinct performance and cooling needs of the worldwide gaming community. These latest DDR3 2400G modules offer new levels of data transfer speed, along with the many features that are hallmarks of the XPG series.
With speed up to 2400Mbps (2400MHz), and transfer bandwidth reaching 19,200 MB/s, the XPG series once again pushes gaming to the next level. The modules support Extreme Memory Profile (XMP) version 1.3, and use ADATA
"By launching these new high-density DDR4 modules, Samsung is embracing closer technical cooperation with key CPU and server companies for development of next-generation green IT systems," said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. "Samsung will also aggressively move to establish the premium memory market for advanced applications including enterprise server systems and maintain the competitive edge for Samsung Green Memory products, while working on providing 20 nanometer (nm) class based DDR4 DRAM in the future."
Using 30 nm-class process technology, Samsung sampled new 8 GB and 16 GB DDR4 modules in June, in addition to providing them to major CPU and controller makers. The modules will bring the highest density and performance levels to premium enterprise server systems. Samsung previously introduced the industry's first 30 nm-class 2 GB DDR4 module in December, 2010.
Employing new circuit architecture for computing systems, DDR4 technology boasts the highest performance among memory products available for today's computing systems, which by next year will reach twice the current 1,600 megabits per second (Mbps) of DDR3 based modules. Also, by processing data far more efficiently at a mere 1.2 volts, Samsung's DDR4 modules will reduce power consumption by approximately 40 percent compared to its predecessor DDR3 modules operating at 1.35V.
Samsung will keep working on completion of the JEDEC (Joint Electron Device Engineering Council) standardization of DDR4 technologies and product specifications, which is expected to be accomplished by August.
The company said it will work closely with its customers including server OEMs, as well as CPU and controller makers, to expand the market base for high-density DDR4 modules, of which it plans to begin volume production next year. It also is set to expand the overall premium memory market with its most advanced 20 nm-class based DDR4 DRAM products, which will be available sometime next year at densities up to 32 GB.
Samsung has been leading the advancement of DRAM technology ever since it developed the industry's first DDR DRAM in 1997. In 2001, it introduced the first DDR2 DRAM, and in 2005, announced the first DDR3 using 80 nm-class technology.
Corsair will soon ship Dominator Platinum DDR3 modules with a frequency of 3000MHz as Huxus reports today:
Soon to be available in an array of dual- and quad-channel kits at speeds of up to 3,000MHz, this premium range will target overclocking aficionados looking to make a statement.
If you're prepared to pony up the cash - and we suspect you'll need plenty of it - you'll be getting hand-screened ICs just dying to be pushed to the limit, Corsair's patented DHX heat spreader (with fins), a custom PCB with copper thermal pads, stainless steel bodywork and a 'polished aluminium light bar' that illuminates over the top to provide that extra bit of bling.
There's also built-in support for Corsair Link connectivity - allowing you to keep a close eye on temperature - and we're told the Dominator Platinum kits will launch in 'limited quantities,' so you may want to start saving the pennies to ensure you're first in line.
ADATA Technology Co., Ltd announced a boost to its XPG Xtreme Series DDR3 lineup with the DDR3-2133X 8 GB and 16 GB dual channel kits. This new entry to XPG Xtreme Series satisfies enthusiasts' increasingly stringent demands for high capacity and performance DRAM modules.
The new ADATA XPG Xtreme Series DDR3-2133X runs at 2133 MHz and an operating voltage of 1.65V with latency settings of 10-11-11-30, allowing for predicted bandwidth up to 34.1 GB per second.
Each XPG memory chip is selected through a strict filtering process and complete with high performance 8-layer PCB (Printed Circuit Board). The chips are in direct contact with the heat spreaders for efficient heat dissipation and prolonged lifespan. The XPG Xtreme Series DDR3-2133X also supports the Intel XMP (Extreme Memory Profiles) version 1.3, providing easy configuration for power users, and is compatible with the Intel P67 / X79 / Z68 / Z75 / Z77 platforms.
The new XPG Xtreme Series DDR3-2133X dual memory kits are already available in the USA and Canada.
- Runs at 2133 MHz
- Operates at 1.65V
- Predicted bandwidth up to 34.1 GB per second
- Supports Intel XMP (Extreme Memory Profiles) version 1.3
- Two models: 8 GB and 4 GB
- Available in the USA and Canada NOW
- 8 GB dual (4 GBx2) = $89.99
- 16 GB dual (8 GBx2) = $189.99
X-bit Labs reports SK Hynix has pulled out of an upcoming auction to buy bankrupt memory maker Elpida. As a result, only two candidates remain: Micron Technology and a joint bid by Hiny Capital and Hony Capital, two private equity funds.
SK Hynix has reportedly decided to pull out from the incoming auction for insolvent Elpida Memory, leaving only two potential buyers for the troubled maker of dynamic random access memory: Micron Technology and a group of private equity funds.
The acquisition of Elpida Memory and its assets, including technologies and a DRAM plant in Hiroshima, Japan, would not "strategically benefit" the company, SK Group's chairman Chey Tae-won told reporters after a board meeting without elaborating, Reuters news-agency reports. Previously SK Hynix indicated that the company was investigating Elpida's financial reports.
G.SKILL, the worldwide leading high performance memory designer, has announced the new TridentX DDR3 memory kit for 3rd Generation Intel Core Processors and Z77 platform.
The ultimate speed up to DDR3 2800 MHz 16 GB(4 GBx4) & DDR3 2666 MHz 32 GB(8 GBx4)
Designed for overclocking enthusiasts, the TridentX series includes a complete lineup of extreme performance DDR3 memory, starting from 2400 MHz 8 GB to 2800 MHz 16 GB. The following screens show the TridentX 2800 MHz 16 GB kit has successfully achieved DDR3 3320 MHz speed, while the 32 GB 2666 MHz kit has achieved DDR3 2933 MHz speed, both results are with 4 DIMMs fully installed under LN2.
Featuring with a removable top fin design, the new TridentX heat-spreader allows overclocking enthusiasts to have more flexible options of memory cooling systems, as well as to reduce the height to fit with large CPU coolers.
G.Skill launched their new line of memory, the Trident X. Its launch is timed to follow that of Intel's Core "Ivy Bridge" processor family, and is optimized for 7-series chipset motherboards (due to their support of latest Intel XMP 1.3 specification).
Pictured below are the DDR3-2400 MHz (PC3-19200) modules in dual-channel configuration.
The XMP profile runs the module at its 2400 MHz DDR (1200 MHz real) speed, with timings of 10-12-12-31T, and DRAM voltage of 1.65V. The modules will be available in various other speed/timing configurations, and in densities of 4 GB and 8 GB, making up for 8 GB and 16 GB dual-channel kits, for the new "Ivy Bridge" platform; 16 GB and 32 GB quad-channel kits for the Sandy Bridge-E platform.
The older Sandy Bridge LGA1155 platform might not be 100% compatible, since it lacks XMP 1.3 support. G.Skill Trident X will be formally announced on May 4.
Patriot Memory announces the launch of their Extreme Performance SDHC/SDXC UHS-I flash storage. Featuring ultra-fast transfer rates and expanded storage capacities, the Patriot Memory EP Series SDHC/SDXC cards are perfect for stunning high resolution digital photography and increased high definition video recording times.
Designed to provide twice the transfer speeds of previous Class 10 solutions, when used with UHS-I compatible devices, the Patriot Memory EP Series SDHC/SDXC cards deliver the performance necessary for capturing and broadcasting in true real-time. With capacities of up to 128GB, these EP Series SDHC/SDXC cards offer a greatly improved maximum volume when compared to standard SDHC solutions. At the 128GB capacity, the Patriot Memory EP Series SDHC/SDXC card is capable of storing up to 2,560 minutes of 1080p video and well over 26,000 high definition photos.