The company is set to take another leap forward, gearing up to mass produce 32Gb DDR5 ICs and high-capacity memory modules in the first half of 2024.

Micron's 32Gb DDR5 ICs will be produced using the advanced 1β (1-beta) fabrication technology, which does not rely on extreme ultraviolet lithography. While the specific data transfer rates of these 32Gb devices have not been disclosed yet, considering they will be Micron's 3rd Generation DDR5 ICs, they are expected to offer impressive performance.

The introduction of 32Gb DDR5 DRAM ICs opens doors for high-capacity monolithic memory devices, particularly useful for datacenter-grade memory modules. Micron plans to offer 128GB DDR5 modules based on these ICs in the next year, with future plans for even larger capacities of 192GB and 256GB DDR5 modules.

Although Micron's roadmap does not currently include 512GB and 1TB memory sticks, these higher capacities may still be considered for select clients in the future. Additionally, Micron's future plans encompass mass-producing 16GB and 24GB GDDR7 memory chips with 32 GT/s data transfer rates, as well as HBMNext memory in 32GB and 64GB stacks offering remarkable bandwidth per module, projected for 2026 or later.

Micron Prepares to Mass Produce 32Gb DDR5 ICs, could do 1TB Memory Modules in 2024