In Win Development, headquartered in Taiwan, has officially unveiled ModFree, a PC case that boasts versatile customization through the integration of three modular components. This innovative PC case leverages the modular design concept introduced during COMPUTEX TAIPEI 2023.
Apart from the foundational "Mod-I" housing the motherboard tray, users can select from three available modules: "Mod-II" and "Mod-III." The tool-free interlock clip mechanism facilitates seamless assembly and customization. The core offering, known as the "Base Edition," includes "Mod-I" and "Mod-II," bundled with three AJ140 ARGB fans. Additionally, the lineup features the "Deluxe Edition," which incorporates two "Mod-III" modules, accompanied by four AJ140 ARGB fans.
Base Edition Specifications:
- Cooling Fans: Front 120/140mm x 2, Top 120/140mm x 2, Rear 120/140mm x 1
- Radiator Support: Front 240/280mm, Top 240mm
- Graphics Card Length: Up to 369mm
- Dimensions: 261.8mm (Width) x 411.5mm (Depth) x 531mm (Height)
Deluxe Edition Specifications:
- Cooling Fans: Front 120/140mm x 3, Top 120/140mm x 3, Rear 120/140mm x 1
- Radiator Support: Front 360/420mm, Top 360/420mm
- Graphics Card Length: Up to 440mm
- Dimensions: 261.8mm (Width) x 511.6mm (Depth) x 631mm (Height)
Both editions support E-ATX, ATX, MicroATX, and Mini-ITX form factors and offer 2.5-inch shadow bays (x 2) and 3.5-inch shadow bays (x 1), with compatibility for 2.5-inch drives (x 2). Additionally, there are nine expansion slots, allowing for a CPU cooler height of up to 200mm and a power supply unit depth of up to 390mm (or 240mm when the HDD tray is installed).
For more information, visit the official In Win ModFree webpage: In Win ModFree
To explore further details and specifications, please visit the following link: ModFree Product Details