on a concave heatspreader the outer chiplets should get better heat transfer...

TieSKey:

Isn't it like... super thick?

According to DerBauer it needs to be this thick to compensate for the change to LGA, as that makes the substrate sit lower in the socket. So in order to still support the current batch of cooling solutions the heatspreader needs to compensate for this and thus it has become thicker. Source (unfortunately only in German) => [youtube=vUB97_YwJiI]

user1:

It also appears amd is intending to keep am4 around for another year or 2 probably for supply reasons, which should carry a decent chunk of their way to their next contract renewal, especially since zen4 based epyc don't appear to launching anytime soon.

quite wrong. Epyc Genoa (& Bergamo) has been in fabrication for months using the (huge) brand new socket SP5. the release is between now and september (Q3 2022) Epyc Genoa X (3D) early next year.

tunejunky:

quite wrong. Epyc Genoa (& Bergamo) has been in fabrication for months using the (huge) brand new socket SP5. the release is between now and september (Q3 2022) Epyc Genoa X (3D) early next year.

amd hasn't announced anything yet as to when sp5 will launch, if it was going to launch before September they would have announced it at computex , imo a q4 launch for genoa seems more likely and availability is unknown, stock-pilling chips is par for the course , especially on new nodes, doesn't tell you much about the launch other than its <6-8months out.

user1:

amd hasn't announced anything yet as to when sp5 will launch, if it was going to launch before September they would have announced it at computex , imo a q4 launch for genoa seems more likely and availability is unknown, stock-pilling chips is par for the course , especially on new nodes, doesn't tell you much about the launch other than its <6-8months out.

not quite. this is far from a paper or vapor launch, the orders from the largest clients (Google, Amazon) were booked in early spring for summer delivery. what AMD is doing is ensuring supply, not dithering, as the fabs have been pumping these out for months. AMD is expecting the (wider) market to respond the same way Google and Amazon (Web Services) have and we should remember most of this market is underserved despite scale. i suspect that may be one reason you are among many waiting with "bated breath". i can truly say a large number of (shipping) units have been received back from overseas, have cleared customs, and are just waiting for AMD's logistics (which includes the magic # of SKUs over and above said Google and Amazon orders). so i guess we see eye to eye on the stockpiling point, but differ on the inference.

Wondering what the iGPU is going to be? Possibility of an 8-core CPU die with an extra iGPU die?

BLEH!:

Wondering what the iGPU is going to be? Possibility of an 8-core CPU die with an extra iGPU die?

The iGPU is baked into the IO Die, not a GPU chiplet.