PNY XLR8 CS3150 PCIe 5.0 NVMe SSD Is Fitted with Two Active Fans

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PNY has introduced the XLR8 CS3150 NVMe SSD, which incorporates a PCIe 5.0 interface and an integrated cooling system featuring a dual-fan RGB heatsink. The SSD is designed to provide a balance of aesthetic customization and thermal management, offering three color variants including black, white, and an RGB-backlit option.

The device dimensions allow for integration with a range of computer cases, maintaining a height of 39.8mm, which is conducive to system compatibility and contrasts with larger alternatives like the Nextorage NE5N. The RGB model includes additional components such as a backplate, thermal pads, the SSD, a heatspreader, and the RGB shroud, yet retains a compact profile.

Technical specifications for the XLR8 CS3150 SSD are as follows:

  • Capacities Available: 1TB and 2TB
  • Memory Type: 3D NAND Flash
  • Interface: PCIe Gen5 x4, NVMe 2.0
  • Form Factor: M.2 2280
  • Package Size: 155.9 x 55.1 x 39.8 mm
  • Product Size: 76 x 23.5 x 17.5 mm (maximum)
  • Weight: 53 grams
  • Sequential Read Speeds: Up to 11,500 MB/s (1TB), Up to 12,000 MB/s (2TB)
  • Sequential Write Speeds: Up to 8,500 MB/s (1TB), Up to 11,000 MB/s (2TB)
  • Heatsink Fan Power: 4-pin connector
  • Power Management Support: S0/PS1/PS2/PS3/PS4, APST, ASPM, L1.2
  • Operating Temperature Range: 0°C to 70°C
  • Storage Temperature Range: -40°C to 85°C
  • Certifications: BSMI, CE, FCC, REACH, RoHS, VCCI, PCIe Base 5.0, NVMe 2.0
  • Mean Time Between Failures (MTBF): 1.6 million hours
  • Error Correction: LDPC ECC
  • Monitoring: S.M.A.R.T capabilities
  • Data Path Protection: End-to-End
  • Performance Features: TRIM support
  • Warranty: 5 years (limited)

Performance metrics are derived from PNY's internal testing and may not reflect real-world scenarios due to varying device configurations.

With the rise of SSDs featuring active cooling solutions, it is important for specifications to include fan details such as bearing type, airflow (CFM), and noise level (dB). These are commonly provided by manufacturers of cooling solutions for other components like CPUs and GPUs.

The trend in the industry is shifting towards SSDs with substantial cooling mechanisms to manage the heat generated by the latest controllers, such as the Phison E26. The cooling efficiency is dependent on several factors, including the design, case airflow, and chip layout. The growing prominence of these bulkier coolers necessitates visibility on the motherboard, diverging from the conventional slim M.2 drives.

Advancements in PCIe 5.0 controller technology, exemplified by the Silicon Motion SM2508 and the InnoGrit G5666, are anticipated to enhance efficiency and cooling in future SSDs, with developments expected to be disclosed at CES 2024 or in similar timeframes. 

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