Intel Faces Wafer-Level Packaging Constraints Impacting Core Ultra Processor Supply in Q2

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Intel's recent earnings call highlighted a significant challenge affecting their production schedule: the company's wafer-level packaging capabilities are currently insufficient to meet the growing demand for its Core Ultra processors. During the call, Intel CEO Pat Gelsinger explained that these limitations would restrict processor supply in the second quarter of the year. Wafer-level packaging, a critical step in semiconductor manufacturing, involves packaging wafers before they are sliced into individual dies. This technology is essential for producing Intel's advanced processors, including the Meteor Lake series and other Core Ultra products. The bottleneck in this process has become a focal point due to its impact on supply chain and delivery timelines.

The demand for these processors has surged partly because of the increasing integration of AI in personal computers and a significant Windows update cycle, prompting customers to place additional orders. Intel initially projected to ship 40 million AI PC CPUs this year, but the company is now racing to exceed this target in response to the higher-than-expected demand.

Despite efforts to accelerate production and resolve packaging constraints, Intel's Client Computing Division anticipates its revenue for the second quarter to mirror the first quarter's performance, approximately $7.5 billion. This projection suggests no expected growth in revenue quarter-over-quarter, directly attributable to the packaging bottleneck.

Intel is actively working to enhance its wafer-level packaging capacity, aiming to mitigate these limitations by the latter half of the year. Successful expansion of these capabilities is expected to relieve the current supply constraints, potentially boosting the revenue of its client division as production scales up to meet ongoing demand.

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Source: ithome

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