Only thing that bothers me with this CPU is temperature??? Is it 95 like other 7000 series, or normal?

Lower speed and lower tdp, it has to consume less and heat less. I haven't seen that data anywhere yet, but I'm sure it will.

butjer1010:

Only thing that bothers me with this CPU is temperature??? Is it 95 like other 7000 series, or normal?

The garbage IHS is the culprit for the high temperatures, so while lowering the TDP must help a lot, it's still treating the symptoms, not the disease itself. Sacrificing CPU performance for the sake of cooler compatibility was such a strange choice.

It can be intresting CPU if PRICE is RIGHT. Right now Zen4 pricing is outragous.

PBO offset was great for reducing temperatures and power usage. And performance was very similar in games. I bet this 7700 non-X will perform very closely to the 7700X in games. BTW, expect a 7800X with 10 cores and 20 Threads. And a 7300X with 4 Cores and 8 Threads.

butjer1010:

Only thing that bothers me with this CPU is temperature??? Is it 95 like other 7000 series, or normal?

The Cpus hitting 95 degrees is a design choice made by AMD in order to extract more performance. I think we can set a lower max temperature limit but I could be wrong. As for this 7700, I was expecting better.

Kaarme:

The garbage IHS is the culprit for the high temperatures, so while lowering the TDP must help a lot, it's still treating the symptoms, not the disease itself. Sacrificing CPU performance for the sake of cooler compatibility was such a strange choice.

Add to that , the majority of custom cooling like for example from EKWB, bitspower and corsair are incompatible with AM5. With few words almost all AM4 blocks that require back plate change are most likely not compatible with AM5. Those that are using the factory plastic brackets of both am4 and am5 are compatible. So they kind of sacrificed 1 mm more metal in the IHS so to keep compatibility with some AIOs and air coolers. I still waiting for my EKwb velocity 2 to arrive, although I managed to properly fit the Velocity I already have for AM4. I have to say though, that all the difference for EKwb blocks is the use of different stand offs or large screws, which looks like EKwb fault and not AMD's

jose2016:

Lower speed and lower tdp, it has to consume less and heat less. I haven't seen that data anywhere yet, but I'm sure it will.

CPU power consumption is not linear with performance. Every architecture has a "sweet spot" for efficiency, where if you push clock speeds above or below that range, the CPU becomes less efficient. Both Intel and AMD have been pushing their chips to very inefficient levels lately. When you have a 16-core CPU draw the same amount of power as 64 cores despite not having 4x the all-core boost clocks, that shows how much the power draw spikes. That being said, I'm looking forward to this CPU, because it still has more than good enough clock speeds to run games but ought to be significantly less power hungry. I just hope it's priced reasonably.

Kaarme:

The garbage IHS is the culprit for the high temperatures, so while lowering the TDP must help a lot, it's still treating the symptoms, not the disease itself. Sacrificing CPU performance for the sake of cooler compatibility was such a strange choice.

I'm not all that familiar with what's wrong with the IHS - is it because of the thickness? In any case, if it pushes AMD to use a more efficient design, wouldn't that be a good thing? To use the disease analogy, exercising and eating vegetables probably isn't going to cure whatever disease you have but it's still good for vitality. AMD should be incentivized to lower TDP regardless of the real problems.

@schmidtbag Zen 4 processors have thicker IHS compared to zen 3 ones. If am not mistaken is about 1 to 1.5 mm thicker. That was made to compensate the height difference of the 2 generation processors and keep compatibility with existing AM4 coolers. As you can understand this has negative impact on zen 4 temperatures. Debauer is claiming about 20 degrees lower, but that was without IHS at all. Was like direct cooling with removed IHS.

Horus-Anhur:

PBO offset was great for reducing temperatures and power usage. And performance was very similar in games. I bet this 7700 non-X will perform very closely to the 7700X in games. BTW, expect a 7800X with 10 cores and 20 Threads. And a 7300X with 4 Cores and 8 Threads.

Yes, this is only reason why i have only consider to buy zen4! As a biggest AMD fanboy ever, i have totally disappointed with AMD and ZEN4. Not with the performance, performance is exceptional, but the only thing i hate about intels 12th gen (now the 13th also) was this much power draw and working temps! I was bragging with "my AMD" to all intel fanboys, but now what 🙂 ? I don't know, this is first new ZEN architecture that i didn't buy on day one! I will consider to buy it, if the prices of MBOs and RAMs "falling down". Right now it is insane (prices)!

sfdmark:

@schmidtbag Zen 4 processors have thicker IHS compared to zen 3 ones. If am not mistaken is about 1 to 1.5 mm thicker. That was made to compensate the height difference of the 2 generation processors and keep compatibility with existing AM4 coolers. As you can understand this has negative impact on zen 4 temperatures. Debauer is claiming about 20 degrees lower, but that was without IHS at all. Was like direct cooling with removed IHS.

The thicker IHS is better when using direct contact heatpipe coolers (hyper 212), a thin heat spreader would not spread the heat out to all heatpipes on the cooler. Other high performance coolers like noctua has a big ass heatspreader on the CPU contact spot to spread the heat to all heatpipes. Der8auer did way to many things at once in his 20 degrees lower video and comparing normal paste, stock IHS vs liquidmetal, no IHS and a completely custom hold down of the CPU to prevent it from warping like Intel. I am willing to bet that he is now forced to use liquidmetal on the die, because normal paste would not be good enough with the smaller chip and no heatspreader. Intel went with a thicker IHS for a reason a couple of generations ago. Also the offset water cooler for Ryzen 5000 CPUes lowers the temperature, indicating that the heat is not spread enough from chip to the entire surface of the IHS. Jay 2 cents also got better temps by sanding down the IHS, but he should have tried to stop when the IHS was perfect flat and test before he started taking it down. Half of his gain could have been from a more flat IHS surface, rather then the less thickness of the IHS.

schmidtbag:

I'm not all that familiar with what's wrong with the IHS - is it because of the thickness? In any case, if it pushes AMD to use a more efficient design, wouldn't that be a good thing? To use the disease analogy, exercising and eating vegetables probably isn't going to cure whatever disease you have but it's still good for vitality. AMD should be incentivized to lower TDP regardless of the real problems.

amd increased the ihs thickness to maintain am4 cooler compatibility, the ihs is only part of the story however. The increased temperatures are mostly due to the increased transistor density of 5nm, the thicker ihs makes it worse,but you're not going to see 20c drops by thinning it, probably between 5-10c at best depending on the cooling solution. negligible performance / effciency loss. Its an issue that only really effects overclockers with bottlenecked cooling potential (custom loop, 360 rad ect.) main reason being is that the 7950x only looses 5% performance going from a 230w tdp to 175w, so even if you've got a fairly underpowered cooler and thermally limiting the power headroom fairly significantly, it isn't going to be that big of a deal.

Meh, it's not bad that there will be more choice, but this will only really get interesting when the 3d versions are released