AMD Working on Vertical (3D) Stacking of DRAM onto processors

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K.S.:

For HEDT consumers, you don’t know that - hell for consumer desktops you don’t know that. No one does. Only the CPU makers. Most being your operative word there; I’d say you have no way of knowing that. I’ll give you many. Popular ultrabook series’ such as ASUS Zenbooks include one modular RAM bay. As do the HP Envy x360s... I could go on.
WTF? Fix your quotes. I did not write that!
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schmidtbag:

It was only a matter of time until this started to happen. Many ARM platforms have been doing this for years. I was thinking the same thing. As far as I'm concerned, we can think of this like an L4 cache. I'm glad they're pushing for HBM and more memory channels too, since that's exactly what AMD needs right now. I think if AMD supplies 0.5GB per CPU core and maybe 0.25GB per GPU core, that ought to be plenty sufficient to start with, as long as you get to supplement with discrete DDR4 memory. The way I see it, DDR4 is relatively slow but it's fast enough where it should be able to load in new data without being a bottleneck, while the integrated RAM is more for "current data". I guess one major concern I have is how much this may hinder overclocking. But, it looks like we're heading to a point of x86 PCs becoming SoCs. Although it's a necessary evolution, it's a little sad to me, in that this is the beginning of the end for hardware enthusiasts. I really hate that quote, not just because Gates never said it, but also because it's always taken out of context. 640K, at the time, was enough for anybody.
I know. It's just their post reminded me of that, if he ever said it or not 😛
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Moderator
K.S.:

Hit refresh & go easy on the cocaine bro, take a breather man’ I’m on an iPhone...
I think both of you need to. @Fox2232
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Dear Gods of hardware let it become true ( APU with dram ( make it 8gb hbm pretty please ) on package ) , that will be the most important and logical move for APUs since the bottleneck is the ram on them.
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I think this article is more illustrative, also there is a video at the end where AMD's Forrest Norrod talks about all of this. https://www.tomshardware.com/news/amd-3d-memory-stacking-dram,38838.html By his words, I think at AMD are looking to implement Samsung's SRAM on their chiplets, instead classic caches, wich will bring more bandwidth, less consumption, less heat, bigger caches, smaller cores, and cheaper products. And they will do it when Samsung's SRAM be available at a smaller lithography node. There exists the possibility of using DDR or HBM with a substrate over the chips, like Intel showed with Foveros, and Radeon engineers blueprinted before. But Forrest Norrod talked about true 3D chips opposed to 2.5D, referring to SRAM lithography printed directly over the chip and impossible to separate. Talking about APUs with HBM, maybe we will be closer now with the new chiplet architecture. Because if they don't do something fast, Intel will have an graphic advantage at the end of the year with their new iGPU.
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Just wait until they start pulling an apple. $300 for 16GB, $500 for 32GB, $1000 for 64GB. All when you could've gotten that ram way cheaper externally.
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I would have expected hbm to have made some sort of appearance on a cpu/apu. Maybe this has something to do with cost.
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K.S.:

Yeah... Hynix, Samsung, etc vs Patriot, ADATA etc still a difference... in variety & upgradeability, ie as with server market. (All this I’m refering to HEDT consumer fyi) For HEDT consumers, you don’t know that - hell for consumer desktops you don’t know that. No one does. Only the CPU makers. Most being your operative word there; I’d say you have no way of knowing that. I’ll give you many. Popular ultrabook series’ such as ASUS Zenbooks include one modular RAM bay. As do the HP Envy x360s... I could go on.
To all that... It does not matter at all. HEDT is small business, it may not be affected at start. Server will not be affected for very long time in loss of replaceable parts. And those tablets, notebooks. If 5% complains, they will buy older model, but they will buy anyway. Then they will bend as Apple's clients did. When this becomes norm, HEDT will bend in same way. Slowly, but steadily. If someone stays behind, his loss. Simple as that. 1st it will be option. And at time it will be norm... stubborn consumer who refuses to move forward will be non-consequential. Technology moves forward and 7nm opens wide door to memory density. In 3 years freaking cellphones will have 16GB of RAM as standard. = = = = But here's the secret. On that image is small TDP device like ultrabook/handheld gaming console. And getting that memory there is to have it accessible at L3 performance. When that happens, I am not going to say: "No!" I'll say: "Hell, Yeah!"
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Who watched google Stream? Looks like another Win for AMD in the gaming segment- for me it looks like they designed custom monster APU with Vega 56 + 16GB HBM2 and Zen CPU! What do you think about it? All consoles use AMD GPU/CPU + next gen consoles + Microsoft game streaming will use AMD's GPU's and now Google also! https://i.postimg.cc/BvGy33Sx/Stadia.jpg [youtube=nUih5C5rOrA] AMD stock right now: https://i.postimg.cc/Fs88PcwC/AMD.jpg
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nevcairiel:

I wonder if at some point we'll actually lose the freedom to pick the amount/speed of DRAM we want, or if this will remain limited to select embedded use-cases.
I think it will be sold in proportional sizes and arrangements, just as it is now. One size would never fit all, etc.
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waltc3:

I think it will be sold in proportional sizes and arrangements, just as it is now. One size would never fit all, etc.
But that seems unlikely, because its also attached to the CPU. The CPU makers don't want to make ten times as many SKUs as they do now, as that makes production incredibly complicated - especially if its all stacked on one substrate. What I could see is varying amount of memory depending on the CPU model you buy. High-end CPU comes with more memory. But if you just want more memory on a lower CPU, they might not offer that. I hope it doesn't come to that as being the exclusive option we face at some point in the future.