Lexar to Showcase New PRO WORKFLOW and Other Products

Published by Hilbert Hagedoorn 0

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Lexar is set to present its latest collection of storage products at the NAB Show from April 14-17, 2024, at the Las Vegas Convention Center. This lineup is engineered to meet the high-performance demands of professional videographers, filmmakers, and content creators, enhancing both in-studio and on-location workflows. The introduction includes the ARMOR series, featuring the ARMOR GOLD and ARMOR SILVER PRO SD UHS-II V60 Cards, designed for durability and high-speed data transfer with maximum read speeds of 280MB/s and write speeds up to 210MB/s. Both cards are IP68 rated, ensuring protection against water and dust, and support 6K video capture. The ARMOR 700 Portable SSD, part of this rugged series, offers maximum read/write speeds of 2000MB/s and is designed with an IP66 rating for enhanced durability against environmental elements.
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Corsair Launches ECC DDR5 RDIMM Memory Kits for Workstations

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Corsair has expanded into the DDR5 workstation market with the launch of its WS DDR5 RDIMM ECC memory kits. These kits are designed to meet the demands of modern workstations, providing enhanced performance and reliability. They are compatible with the latest 4th Gen Intel Xeon and AMD Ryzen Threadripper 7000 series processors. The new Corsair memory kits are available in various capacities, reaching up to 256 GB, to cater to memory-intensive applications such as 3D rendering, high-resolution media editing, and AI training. These ECC RDIMM modules have been rigorously tested to ensure they exceed JEDEC standards, offering tighter timings and higher frequencies for optimal performance under demanding workloads.
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MSI Launches MPG EZ120 ARGB: Innovative Magnetic Cableless PC Fans

Published by Hilbert Hagedoorn 8

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MSI introduces the MPG EZ120 ARGB fan series, designed to simplify PC assembly with its cableless, magnetic design. This series features the MSI exclusive JAF 7-pin header, which combines ARGB and system fan connectors to improve cable management. The fan is equipped with 33 LEDs on the blade and frame, enhancing the aesthetic appeal of panoramic-style PC cases. The MPG EZ120 ARGB fan series stands out for its Magnetic Connector Blocks, which facilitate easy and secure connections by delivering both power and signals to the fans. The inclusion of magnets in each fan frame streamlines the assembly process.
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FSP Group Launches VITA GM Series: High-Efficiency Modular PSUs

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FSP Group, a globally recognized manufacturer of high-performance power supply units (PSUs) and PC components, has announced the release of its VITA GM series. This new lineup of PSUs is designed to meet the evolving demands of personal computing, offering models with power capacities ranging from 650W to 1000W. Each PSU in the series is distinguished by its 80 Plus Gold certification, indicating a high level of efficiency in power delivery. The VITA GM series is engineered with future computing needs in mind, adhering to the latest technical standards.
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Team Launches T-CREATE EXPERT R31 3-IN-1 Card Reader

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Team Group, today unveils the T-CREATE EXPERT R31 3-in-1 Card Reader, specifically crafted for the diverse file transfer needs for post-production efficiency, offering enhanced portability and versatility. This innovative solution empowers content creators and photographers to access and edit materials on the go with ease, ensuring an uninterrupted creative workflow. With its exceptional efficiency in instant transmission and editing, the EXPERT R31 offers creators a more simplified workflow, unparalleled convenience, and enhanced productivity.
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Intel Announces Discontinuation Notice of 13th Gen Raptor Lake-S Boxed Processors

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Intel has officially announced the discontinuation of its 13th Generation Raptor Lake-S "K", "KF", and "KS" series boxed processors, marking the end of this product line. The final shipment of these processors is scheduled for June 28, 2024. This move is part of Intel's product lifecycle management and coincides with the presence of the 14th Generation processors in the market, which also belong to the Raptor Lake-S series.
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AMD (and Intel) Motherboards Receive BIOS Updates to Address LogoFAIL Vulnerability

Published by Hilbert Hagedoorn 8

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Recent updates to AMD's AGESA firmware have prompted motherboard manufacturers to release BIOS updates that address LogoFAIL, a security vulnerability identified in December 2023. This flaw, capable of hijacking the UEFI boot screen, is not limited to a specific processor manufacturer and affects both Intel and AMD platforms utilizing BIOS firmware from independent vendors such as AMI, Phoenix, and Insyde.Intel responded to the discovery of LogoFAIL by releasing an update for its Management Engine (ME) to version 16.1.30.2307. AMD addressed the issue through its AGESA firmware, initially with version 1.2.0.b and subsequently with an enhanced 'c' version that rectifies additional vulnerabilities. Companies like Gigabyte, Asus, and MSI have begun distributing BIOS updates incorporating these AGESA versions to bolster security against LogoFAIL. However, updates for motherboards with X670 chipsets have not yet been released.
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Thermaltake Introduces TH V2 Ultra EX ARGB Sync Series AIO Coolers with MagForce 2.0 Technology

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Thermaltake recently announced the launch of its TH V2 Ultra EX ARGB Sync series of All-In-One (AIO) liquid coolers, incorporating the MagForce 2.0 Design for enhanced connectivity and performance. This series is aimed at providing efficient cooling solutions within a reasonable price range, featuring a customizable LCD display for a personalized user experience. The series includes models TH240/360 V2 Ultra EX ARGB Sync, equipped with 120 mm CT EX ARGB Sync Fans, and TH280/420 V2 Ultra EX ARGB Sync, featuring 140 mm CT EX ARGB Sync Fans. The MagForce 2.0 Design, an evolution from the previous Magnetic Force Design, offers larger Pogo pin contact pads for a more stable and quick magnetic connection, facilitating better cable management and ease of installation.
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GEEKOM XT12 Pro: A Compact Mini PC with Core i9-12900H Processor

Published by Hilbert Hagedoorn 2

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GEEKOM has launched the XT12 Pro mini PC, featuring the Intel Core i9-12900H processor, now open for pre-order. This device integrates 32 GB of DDR4 RAM, a 1 TB SSD, and comes with Windows 11 Pro pre-installed, priced at approximately $699. The XT12 Pro is constructed with a uni-body aluminum chassis, dimensions of 117 x 111 x 38.5 mm, and presents a minimalist design with an anodized matte finish. Despite its compact size, the XT12 Pro offers a comprehensive set of I/O ports, including two USB4 ports capable of 40 Gbps, four USB-A ports, two HDMI 2.0 ports, a 2.5 Gbps Ethernet port, and a 3.5 mm audio jack.
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Intel Offers Star Wars Outlaws Game Bundle with 14th Gen Core Processors

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Intel has partnered with Ubisoft to include Star Wars Outlaws as a bundled game with certain 14th Gen Core processors. This promotion applies to a range of Intel's products, such as desktop processors sold at retail, desktop systems equipped with these processors, and laptops that utilize the 14th Gen Core HX-series mobile processors. The offer is currently available in selected markets through authorized retailers and is set to run until July 31, 2024. Customers who purchase eligible products within this period will receive game redemption codes, which can be redeemed until September 15, 2024. Since Star Wars Outlaws is scheduled for release on August 30, 2024, early redemptions will be considered as pre-orders, allowing participants to access the game starting from its launch date.
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AMD APU Graphics to Retain RDNA3+ Architecture Through 2027

Published by Hilbert Hagedoorn 5

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AMD is set to maintain the RDNA3+ architecture for its APU (Accelerated Processing Unit) graphics until at least 2027. This decision is attributed to AMD's partnership with Samsung on the Exynos project, which has limited the company's ability to make significant architectural updates to its APU graphics. Consequently, AMD will extend the use of the RDNA3+ architecture, initially expected to debut in the forthcoming AMD Zen 5 "Strix Point" APUs, which are anticipated to launch in mid-2024. The RDNA 3+ graphics architecture, also referred to as GFX115X or RDNA 3.5 in technical circles, has been under development for some time and has previously been identified in Linux patches. This architecture is essentially an optimization of the existing RDNA 3 series, currently employed in Radeon RX 7000 GPUs and Ryzen 7040/8040 APUs.
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TP Link Deco BE75: A Wi-Fi 7 Tri-Band Mesh Router

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TP Link announced the release of the Deco BE75, a tri-band mesh router designed to support the latest Wi-Fi 7 standard. The Deco BE75 is equipped to operate across three frequency bands: a 6GHz band capable of 11,520Mbps using a 320MHz width, a 5GHz band with a capacity of 4,320Mbps, and a 2.4GHz band capable of 688Mbps. The package includes two units, enabling users to establish a mesh network immediately, enhancing the coverage and stability of their home or office internet connection. Additionally, this router is compatible with existing Deco series products, allowing for easy integration into current network setups. For those requiring wired connections, the Deco BE75 offers a 10 Gigabit RJ45/SFP+ WAN/LAN combo port alongside three 2.5 Gigabit WAN/LAN ports, catering to high-speed network needs. The router is also equipped with six high-gain antennas to ensure broad and reliable wireless coverage.
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DeepCool Launches CH360 Series: High Airflow MicroATX Cases with Extensive Mesh Design

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Meet the the CH360 series from the DeepCool brand. These MicroATX cases are designed for high airflow and are compatible with MicroATX motherboards. The CH360 series features several models, including the standard black "CH360" and the white "CH360 WH." Additionally, the "CH360 DIGITAL" and "CH360 DIGITAL WH" models come with a digital panel on the lower part of the left side for real-time system monitoring. The CH360 DIGITAL models, in particular, focus on maximizing airflow. They are designed with mesh sections not only at the front and top but also at the bottom of the tempered glass side panel. The case supports the installation of up to eight cooling fans: two 140mm ARGB fans are pre-installed at the front, and one 120mm ARGB fan at the rear. Users can add up to three 120mm or two 140mm fans at the front, two 120mm or 140mm fans at the top, one 120mm or 140mm fan at the rear, and two 120mm fans on the PSU shroud. For water cooling enthusiasts, the case accommodates up to a 360mm radiator at the front, a 240mm radiator at the top, and a 120mm radiator at the rear.
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More AMD RDNA 4 GPU Lineup info surfaces: Navi 48 and Navi 44 Details

Published by Hilbert Hagedoorn 36

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While the official launch of AMD's RDNA 4 GPU architecture might not occur within 2024, leaked specifications suggest the lineup will include only two models: Navi 48 and Navi 44. This information, appearing on the X platform, aligns closely with AMD's current plans according to credible sources. The Navi 48 model is reported to feature 64 Compute Units, a 256-bit memory interface, and a memory bandwidth of 693 GB/s, potentially reaching up to an effective 2770GB/s. This GPU's die size is expected to be around 240mm². For comparison, the Radeon RX 7800 XT, powered by the Navi 32 GPU, occupies a larger area of 346mm², with 60 Compute Units and a slightly lower memory bandwidth of 624.1GB/s.
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Intel Previews Lunar Lake with Enhanced AI Capabilities at Vision 2024

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Intel unexpectedly unveiled its upcoming Lunar Lake processors ahead of the anticipated announcement at Computex 2024, during the Vision 2024 event. Initially, there was confusion in the media, with some reports mistaking Lunar Lake for the previously discussed Meteor Lake. However, it has been clarified that Lunar Lake will incorporate LPDDR5x memory, distinguishing it from its predecessors. Lunar Lake is set to feature the Intel Core Ultra 200V, a component of the Intel Core Ultra 2 series, promising significant advancements in AI computational speeds over the Core Ultra 1 series. Intel CEO Pat Gelsinger highlighted at the Vision 2024 event that Lunar Lake processors are expected to deliver a threefold increase in AI performance, with the capacity to exceed 100 TOPS (tera operations per second) in total processing power.
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Razer Introduces BlackShark V2 Pro Gaming Headsets for Console Platforms

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Razer announced the extension of its BlackShark V2 Pro series to include versions specifically designed for PlayStation and Xbox gaming consoles. This expansion builds on the renowned performance of the BlackShark V2 Pro for PC, adapting it for the console gaming environment to cater to the high demands of PlayStation and Xbox esports communities. The console variants aim to deliver precise audio quality, clear voice communication, extensive battery life, and comfortable wear for extended gaming sessions. The development of the console editions of the BlackShark V2 Pro was informed by feedback from professional gamers and esports athletes, ensuring the headsets meet the exacting standards of competitive gaming. Key features include the Razer HyperClear Super Wideband Mic, known for its exceptional voice clarity across a broad frequency range, ensuring clear in-game communication.
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Micron Introduces First Quad-Port SSD for Next-Gen Intelligent Vehicles

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Micron initiated the sampling of its automotive-grade Micron 4150AT SSD, marking a significant advancement in storage solutions for software-defined intelligent vehicles. This SSD is the first in the industry to offer a quad-port design, enabling it to connect with up to four System on Chips (SoCs), thereby centralizing storage and enhancing efficiency in vehicle systems.The Micron 4150AT SSD incorporates leading-edge technologies including single-root input/output virtualization (SR-IOV), a PCIe Generation 4 interface, and a design tailored for automotive applications. These features equip the SSD with the capability to provide data center-level flexibility and performance, catering to the increasing storage demands driven by AI integration and advanced algorithms for autonomous vehicle safety.
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Intel Introduces Xeon 6 Branding for Next-Generation Processors

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Intel has announced a significant update to its Xeon processor lineup during the Vision 2024 event, unveiling the new "Xeon 6" branding for its forthcoming Granite Ridge and Sierra Forest processors. This shift from the traditional generational naming convention is intended to streamline the product portfolio and improve customer understanding of the Xeon series. The change aligns with Intel's recent simplification of consumer CPU names, aiming for clearer and more intuitive product identification. The first processors to adopt the "Xeon 6" label will be the Sierra Forest and Granite Ridge models, with launches anticipated in the near future. Sierra Forest, notable for its architecture composed entirely of efficiency cores (E-cores), is on schedule for release within this quarter. Supermicro has already initiated early access and remote testing opportunities for these upcoming chips, signaling strong industry readiness.
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Intel Advances Enterprise AI with Gaudi 3 Accelerator and Strategic Initiatives

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During the Intel Vision 2024 conference, Intel announced the introduction of the Gaudi 3 accelerator, aimed at enhancing performance and offering greater flexibility for enterprise generative AI (GenAI) applications. This move is part of Intel's broader effort to facilitate the adoption of GenAI in the enterprise sector, which has seen limited success in transitioning projects from pilot to full-scale production. Intel's announcement also included the launch of a series of new open and scalable systems, alongside next-generation products and partnerships, designed to overcome common obstacles in AI deployment such as complexity, data security, and compliance. The Gaudi 3 AI accelerator, in particular, is highlighted for its performance capabilities as well as its energy and cost efficiency, addressing the critical needs of businesses aiming to scale their GenAI initiatives.
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Intel Battlemage Graphics Cards Set for Launch Ahead of Black Friday 2024

Published by Hilbert Hagedoorn 10

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Sources within the industry have indicated that Intel plans to release its Battlemage series of graphics cards prior to the Black Friday shopping event, scheduled for November 29, 2024. This strategic timing could play a crucial role for Intel, aligning with the significant consumer interest generated during this period. Intel's inaugural Arc series graphics card was launched in early October 2022, suggesting a pattern where a November release could capitalize on the year-end shopping surge. However, Intel has maintained discretion regarding the specifics of the Battlemage series, with official statements focusing on the ongoing development and a pronounced emphasis on software enhancements.
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