Intel Steps Away From Ringbus - Skylake-X & SP Communicate through Mesh

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It is no brainer that amd approach as glue smaller die is cheaper to produce but there is one more thing, to produce more cored cpu amd have to just glue more smaller die where intel have to design whole new chip
Its not like theres really much of a difference though. Intel has cores with a cache and on chip fabric, as well as memory controllers etc. Their big and small chips have the same microarchitecture cores. The larger dies simply have more of them. Its not like the architecture is that fundamentally different between the big or small chips of the same architectural family. Yes they would have to make more masks than if they essentially only made one chip though.