This was shown to be a marketing slide mockup and not a real die shot. https://www.hardocp.com/news/2017/06/05/amd_rx_vega_radeon_frontier_die_shot_faked_by_marketing

This was shown to be a marketing slide mockup and not a real die shot. https://www.hardocp.com/news/2017/06/05/amd_rx_vega_radeon_frontier_die_shot_faked_by_marketing

Yeah but It is one of the nicest ways I have seen die info represented for a CPU or GPU. Kind of neat to superimpose it over the actual chip(not just the die).

HBM2 dimensions: 11.87 * 7.75 mm That taken converted to pixels and reverse pixeling of GPU die makes it 25.17 * 19.57 mm. So ~493mm^2 ... Comparing to Fiji ~596mm^2 ... Hmm, Kind of Big. With Ryzen AMD puts 4.8B transistors into ares of ~195mm^2. That could place Vega around 12.1B transistors. That's good 36% more than Fiji. Where are they? What are those things I do not see on image? Even IMC should save transistors due to using 2*HBM2 instead of 4*HBM1. Or did AMD decided to use "dead die" and has "empty space" (just matter not actual transistors) in between certain parts to reduce current leakage, improve cooling and achievable frequency?

Or did AMD decided to use "dead die" and has "empty space" (just matter not actual transistors) in between certain parts to reduce current leakage, improve cooling and achievable frequency?

This seems to happen with Threadripper.

Curious how does DEAD DIE work in terms of an insulator? It acts like an internal heatsink passing thermal waste / energy out to lid then to the heat sinks for dissipation?

This seems to happen with Threadripper.

Eh? Threadripper is just two Zeppelins on same package. I.e. two Ryzen chips. Vega is nothing like that.

Eh? Threadripper is just two Zeppelins on same package. I.e. two Ryzen chips. Vega is nothing like that.

I agree, I just replied as to where AMD seems to be literally using empty space. Vega is a die in itself, so we really have no idea where AMD has dark silicone.