AMD Fusion is a new approach to processor design and software development, delivering powerful CPU and GPU capabilities for HD, 3D and data-intensive workloads in a single-die processor called an APU. APUs combine high-performance serial and parallel processing cores with other special-purpose hardware accelerators, enabling breakthroughs in visual computing, security, performance-per-watt and device form factor. It is expected by developers to release appropriate optimized software drivers to utilize this AMD Fusion APU technology.
So far, Advanced Micro Devices is working on next-generation mobile chip architecture code-named Ontario. This architecture will be used in chips manufactured using the 40-nm process embedded in integrated graphics processing unit and all iterations should use DDR3 memory system technology. This chip aims either at graphics or chipsets but there is no any reference for CPU implementation so far.
The latest information we manage to gather indicates an amazing low power consumption profile decreased to just only 9W TDP (Thermal Design Power) with graphics enabled. Apparently, this implies that Ontario will possibly target at Intel’s Atom market, fair enough to beat the challenge. For instance, the Intel Atom N55 dual-core at 1.5GHz has a TDP of 8.5W. However, Ontario with just 9W TDP is much more appreciated due to its better graphics performance.
As all consumers know, this coming soon AMD Fusion technology is going to flutter the dovecotes of computing. Further details or information about Fusion are not disclosed but we surely know that the company has it scheduled for release in 2011 [via Fudzilla].
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