Joe Chen, President at MediaTek, highlighted the significance of the Dimensity 9300, stating, "The Dimensity 9300 is MediaTek's most potent flagship chip to date, introducing a significant leap in raw computational power to flagship smartphones through our pioneering All Big Core design. This distinctive architecture, complemented by our enhanced on-chip AI Processing Unit, will usher in a new era of generative AI applications, as developers harness the potential of edge AI and hybrid AI computing capabilities."
The Dimensity 9300 integrates MediaTek's next-generation APU 790 AI processor, specifically designed to elevate generative AI performance and energy efficiency, thereby enabling faster and more secure edge computing. The APU 790 achieves a twofold increase in integer and floating-point operations performance while reducing power consumption by 45%. By optimizing the Transformer model for operator acceleration, the APU 790 achieves processing speeds eight times faster than its predecessor, enabling rapid image generation within a single second using Stable Diffusion.
MediaTek has also introduced mixed-precision INT4 quantization technology, in conjunction with NeuroPilot memory hardware compression, to maximize memory bandwidth utilization and significantly decrease memory requirements for large AI models. The APU 790 offers support for NeuroPilot Fusion, capable of continuous LoRA low-rank adaptation and accommodating large language models with parameters ranging from 1B to 33B.
As part of MediaTek's comprehensive AI ecosystem, the Dimensity 9300 is poised to facilitate the deployment of cutting-edge mainstream large language models, including Meta Llama 2, Baichuan 2, Baidu AI LLM, and more. This empowers developers to efficiently create multi-modal generative AI applications that provide users with diverse generative AI experiences, encompassing text, images, and music.With Arm's latest flagship GPU, the Immortalis-G720, the Dimensity 9300 supercharges mobile gaming experiences. The Dimensity 9300 offers an almost 46% boost in GPU performance while at the same level of power consumption as the Dimensity 9200. The Dimensity 9300 provides a 40% reduction in GPU power consumption at the same level of performance as the previous generation chipset.
The Dimensity 9300 reimagines mobile photography and video capture by combining a low-power AI-ISP and always-on HDR up to 4K resolution at 60 frames per second (FPS). The chipset also supports 4K at 30 FPS cinematic mode with real-time bokeh tracking for professional quality bokeh enhancements, as well as 4K AI Noise Reduction (AI-NR) and AI processing on RAW photos and videos. It will support the new Ultra HDR format in Android 14 for the next generation of smartphones.
The Dimensity 9300 display system leverages the chipset's powerful on-device AI capability to detect primary objects and background images in real-time. Coupled with the MiraVision Picture Quality (PQ) engine, it will dynamically adjust the optimal contrast, sharpness, and color of primary objects, comparable to today's Flagship DTVs.
Other key features include:
- Big core power: The Dimensity 9300 is built on TSMC's third generation 4 nm process with four Arm Cortex-X4 cores with operating speeds of up to 3.25 GHz and four Cortex-A720 cores operating up to 2.0 GHz to maximize performance.
- Faster display speeds: It supports WQHD at 180 Hz and 4K up to 120 Hz to provide stunning visuals, along with dual active display support for foldable form factors.
- Seamless 5G connectivity: The 5G R16 modem supports 4CC-CA Sub-6 GHz and 8CC-CA mmWave with MediaTek's UltraSave 3.0+ technology for improved power efficiency.
- Speedy memory: Dimensity 9300 supports LPDDR5T 9600 Mbps memory, currently the highest speed available.
The first smartphones featuring the Dimensity 9300 chipset will be available in the market by end of 2023.
