Frore Systems Reveals AirJet Mini Slim: Advancements in Solid-State Active Cooling

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Frore Systems introduces the AirJet Mini Slim, an advanced, more compact version of the Solid-State Active Cooling Chip, building on the foundation set by the original AirJet Mini. The AirJet Mini Slim features a reduced profile of 2.5 mm thickness and 8 g weight, improving upon the original by 0.3 mm and 1 g, respectively. This enhancement maintains the chip's efficient heat removal capability.

The AirJet Mini Slim incorporates an intelligent self-cleaning system designed to address dust accumulation, a prevalent issue in electronic devices. This feature enables the AirJet to reverse its airflow, effectively removing dust from the filters, thereby maintaining optimal performance and longevity. A notable innovation in the AirJet Mini Slim is Thermoception, a feature that allows the chip to independently monitor its temperature and adjust performance accordingly. This autonomous temperature regulation is particularly beneficial for devices without integrated CPUs or temperature sensors, enhancing cooling efficiency. Dr. Seshu Madhavapeddy, Founder and CEO of Frore Systems, highlights the significance of the AirJet Mini Slim's reduced thickness, emphasizing its role in improving thermal management in slim electronic devices.

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The AirJet Mini Slim, measuring 2.5 mm in thickness and weighing 8 g, maintains the compact footprint of its predecessor (27.5 mm x 41.5 mm). Each chip is capable of dissipating 5 W of heat, offering scalability for enhanced cooling in a variety of applications, including notebooks, mini-PCs, tablets, smartphones, SSDs, IoT devices, DSLR cameras, WiFi access points, LED lighting, and industries such as data centers and automotive applications.


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