Intel Talks "Lakefield" Foveros Package
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Kaarme
It does sound very useful for low-power chips for small devices, be they embedded or handheld. For high-power chips I'm sure the cooling will be a challenge without Intel's favourite ozone layer destroying industial cooler solutions.
JamesSneed
schmidtbag
Zeka
Excellent opportunity to introduce a new socket, Intel is playing all the old hits.