Lol .. I wanna see how much Intel can go ,crapping with their pc customers .

But can't you just use a very thin layer of normal glue (the transparent stuff) ? like superglue for example ? Or do you need something similar like the stock black glue ?? I'm asking because I'm thinking of getting an i7 7700k and OC'ing to 5Ghz and was thinking of delidding it myself (altough I am probably gonna do it with a sharp razor xD) since I am going for a very silent gaming rig with a 480rad (60mm thick) and fans in push&pull 🤓 PS: its my understanding that Intel not only put cheap paste in there but they also apply too thick of a layer of glue and they don't apply enough pressure to reduce the gap between the IHS and die. 🙂

Dont bother with push/pull....there is no need, as for push or pull you`ll get similar results either way.

Doesn't the glue raise the IHS too high above the die so that there is a gap, unlike if you just placed the IHS onto the die?

In order for my 4670k to get proper CPU die to IHS contact, i had to remove the IHS and shave the underside of the IHS so when i put it back together it would sit a tiny bit lower and made proper contact. The moment the lid popped off my chip, the warranty was out the window. I find it sad that some people would actually try and RMA a chip they did this to. There are inherent risks to modding an IHS or just replacing the TIM under the lid and people need to assume responsibility if things go wrong, because it is they who should take the financial hit, not Intel. edit/ Forgot to mention, at 4.2ghz my stock i5-4670k under full load torture testing would hit 90'c @ 1.3v. After shaving down the underside face (lip) of the IHS so it sat a tiny bit lower so the gap was eliminated, the chip would hit a max of 65'c under full load with same clocks using a Thermalright Venemous X. I now have that same chip cooled along with my 780 ti in a custom loop (DDC 10w, 360mm and 280mm rads) and the CPU while running OCCT Linpack maxes out at 51'c. During gaming it hits around 40'c.