Thermalright released a new mount frame LGA1700-BCF in the retail market to address a warp issue of the LGA1700 CPU.
The objective is to increase CPU-to-cooler adhesion by removing and replacing the normal ILM surrounding the Intel LGA1700 socket. However, it must be used cautiously since it is a modification that voids the warranty. Black, gray, and blue are the colors. The material is machined aluminum, the measurements are 50x70x6mm, the weight is 20g, and it's yours for roughly 15 USD..
Thermalright introduces LGA1700-BCF, a frame for addressing warp issues in LGA1700 CPUs.
