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Guru3D.com » News » Rambus and Kingston Collaborate for Threaded Memory Module

Rambus and Kingston Collaborate for Threaded Memory Module

by Thorsten Finck on: 09/22/2009 10:24 AM | source: | 0 comment(s)

Kingston and Rambus announced in a press release that they built a partnership in order to work on a "threaded module prototype using DDR3 DRAM technology."

Initial benchmark results "show an improvement in data throughput of up to 50 percent, while reducing power consumption by 20 percent compared to conventional modules."

"As multi-core computing becomes pervasive, DRAM memory subsystems will be severely challenged to deliver the data throughput required," said Craig Hampel, Rambus Fellow. "Our innovative module threading technology employs parallelism to deliver the higher memory bandwidth needed for multi-core systems while reducing overall power consumption."

"Threaded memory module technology is implemented utilizing industry-standard DDR3 devices and a conventional module infrastructure. It is capable of providing greater power efficiency for computing systems by partitioning modules into multiple independent channels that share a common command/address port. Threaded modules can support 64-byte memory transfers at full bus utilization, resulting in efficiency gains of up to 50 percent when compared to current DDR3 memory modules. In addition, DRAMs in threaded modules are activated half as often as in conventional modules, resulting in a 20 percent reduction in overall module power."

Rambus is going to showcase this prototype at the Intel Developer Forum, September 22





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