The Dimensity 6100+ SoC delivers premium features, including power efficiency, vivid displays, high frame rates, AI-powered camera technologies, low power consumption, and reliable Sub-6 5G connectivity.
MediaTek introduces the Dimensity 6000 series, along with a chipset specifically designed to enhance the next generation of mainstream 5G devices.
Key Features of the Dimensity 6100+ Chipset:
- Enhanced 5G Modem: Integrates an enhanced 5G modem supporting 3GPP Release 16 standard, with up to 140 MHz 2CC 5G Carrier Aggregation. MediaTek UltraSave 3.0+ technology significantly reduces power consumption.
- CPU Architecture: Features two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores, offering improved performance, AI-powered cameras, 10-bit displays, GPU performance, and rich peripheral features.
- Camera Support: Up to 108MP Non-ZSL camera support and up to 2K 30 FPS video capture.
- Power Efficiency: UltraSave 3.0+ technology reduces 5G power consumption by 20% compared to competitive solutions.
- AI-Powered Features: Includes AI-bokeh for stunning portraits and selfies. MediaTek, in collaboration with Arcsoft, brings AI-color technology to mainstream devices, enabling users to showcase their creativity.
- Premium Display Support: Supports 10-bit displays, reproducing over one billion colors for vibrant images and videos. Offers support for 90 Hz to 120 Hz frame rates for a smooth user experience.
MediaTek's 5G Portfolio: MediaTek's 5G portfolio caters to different price tiers, making great mobile experiences accessible. The Dimensity 9000 series targets flagship smartphones and tablets, the Dimensity 8000 family is designed for premium mobile devices, and the Dimensity 7000 lineup expands the range of high-tech devices. With the Dimensity 6000 series, higher-end features are now available to mainstream 5G devices.
The first smartphones featuring the Dimensity 6100+ chipset will be available in the third quarter of 2023
