Intel slide of future GPU shows it could use 400 to 500 watts with 4 'stacked' chiplets

Website Digital trends have uncovered a slide originating from intel, that by itself is nothing that special however it holds info on a future Intel GPUs can have a hefty TDP of up to 500 watts.

The graphics processor would be chiplet based, much to what AMD is doing with Threadripper and Ryzen 3000. In fact, four, what is referred to as; tiles make a chiplet. The interesting part is that some TDPs are noted down as well, running to 400 and 500 watts indicative of a datacenter product. The chiplets are different from AMD's technology, as Intel would stack them with their foveros technology, much like an HBM2 stack on a graphics processor. In between the stacks you'd find an embedded multi-die interconnect bridge, in combination with pcie 5.0. Earlier info indicated that a each shader cluster would hold 128 EUs. So that's 512 EUs total.