Product Teardown

Teardown

We know it, you like a teardown and want to look to see what is going on at the PCB level. Opening up that trunk reveals a massive cooler. Nice to see are thermal padding everywhere and additional heatsinks in place at crucial segments. This also makes the card more sturdy, preventing it from bending. The backplate also reveals loads of thermal pads, helping cool down critical elements a bit. You'll notice that at that backside, for example, the GPU and GDDR6 IC locations are padded as well as part of the VRM. The GDDR6 chips register back as made by Samsung, qualified and validated to run 16 Gbps. The GPU voltage phases are managed and fed by an International Rectifier IR35217, backed by NCP302045 (45A) MOSFET drivers backing that GPU voltage. The remaining two phases are for the GDDR6 memory power and managed by an NCP81022N controller. The GDDR6 DRAM ICs themselves are fabricated by Samsung and list under the product code "K4ZAF325BM-HC16," rated at 16 Gbps.