Delidded Core i7 7700K runs 26 Degrees C cooler
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coth
My 2500K was running with passive Corsair H70 for a few years. It was 45-50C in idle and 60C in load.
LevelSteam
I really hope Zen puts AMD back in direct competition with Intel again. This is just getting silly.
Enticles
stereoman
Every chip's different 26 degree drop after delid is massive tho, I saw an average of 13 degree difference after delidding my 4790k which was enough to run 4.8ghz 24/7 so it's definitely worth the trouble but it's a shame to have to resort to this and the fact that it voids the warranty as well.
you can see my results here http://forums.guru3d.com/showthread.php?t=409984
PrMinisterGR
GeniusPr0
Broadwell e is awesome. I load at 30c with H105 fans running around 1300rpm.
These cpus are best used in a mobile space I guess since they come without IHS.
Neo Cyrus
waltc3
If merely delidding the cpu would effect this kind of a massive temp change to the better--it wouldn't make sense for Intel (or AMD) to sell such a cpu in the customary lidded form factor. Interesting though...have to be other factors involved, I'd bet.
cyclone3d
Gaidax
To be honest, I do not understand how this even should be a thing, they spend billions on optimizing this **** only to have some dude pop the top and use some better, smarter placed paste there slashing temps?
I mean really? It does not matter if it's 20 degrees, 10 degrees or even 5 degrees, it simply should not be the thing!
Amx85
Intel TIM sometimes is trash...
Remenber Haswell before "Refresh" had higher temps than Vishera lol
I hope Zen be great overclocker but i will use stock clocks for 24/7
HeavyHemi
I'd have to see more than one example and more rigorous testing. The only thing that kind of stood out was the TIM seemed to be a pretty thick layer between the die and lid.
Yes they spend all that money optimizing the product for the most profit. For consumer use, the vast majority would not care or know about this. It's a niche concern. However the niche does make a lot of noise, which is good and sometimes leads to a better product.
Elder III
That's a pretty drastic difference.... I'd like to see if this can be replicated with other units to see if that particular cpu was a dud or if something's not being reported accurately here. I don't suppose Intel would let HH delid their review sample sometime early next year? 🤓
icedman
^would be funny if we found out the review sample was soldered, I could totally see that lol.
pegasus1
Not really comparing apples with apples by using different coolers.
However Intel did go through a phase of concave heatspreaders so the temps of a stock chip can be improved on.
TheDeeGee
So what did Intel use? Toothpaste?
pegasus1
AnkaMusik
Out of the AnandTech article
EDIT:
Out of curiosity I googled 7700k delid and saw a number of websites reporting on my findings of the 30 degree temp drop, but were unsure on cooling method in both tests so thought I should clarify: The before and after tests were 100% identical (with exception of delid) to isolate the delid, both tests used:
The same cooler at the same setting: Kraken X62 - Fan @ 50% and pump at @ 65% (by the way, this cooler is only about 3 degrees cooler than the H110i, but has better config available)
Exactly the same BIOS settings - which was a x50 multiplier and voltage offset with LLC level 2 resulting in a stable 1.344v under prime 95 load
Memory stock (C15) and Uncore stock.
Prime 95 v27.9 run for 15 minutes in both tests.
Denial
People keep saying it's the TIM Intel is using, it's not.
https://forums.anandtech.com/threads/delidded-my-i7-3770k-loaded-temperatures-drop-by-20%C2%B0c-at-4-7ghz.2261855/page-23#post-34053183
The IHS adhesive they use on the edges is too thick and creates a gap. Pulling the IHS off, removing the adhesive on the IHS and reseating it with the same TIM is just as effective as replacing the TIM.
They need to find a different way to mount he IHS onto the CPU without the gap. They stopped using solder because they found that multiple thermal cycles on smaller die chips were causing voids/micro cracks in the solder - dropping thermal connectivity and in some cases completely severing the connection of the chip to the solder.
user1