Toshiba Unveils UFS Devices Utilizing 64-Layer 3D Flash

by Hilbert Hagedoorn on: 11/29/2017 08:17 AM | source: | 0 comment(s)

Toshiba started sampling Universal Flash Storage (UFS) devices utilizing BiCS FLASH 3D flash memory. The new UFS devices meet performance demands for applications that require high-speed read/write performance and low power consumption, including smartphones and tablets.

The new line-up will be available in four capacities: 32 GB, 64 GB, 128 GB and 256 GB. All of the devices integrate flash memory and a controller in a single, JEDEC-standard 11.5 x 13 mm package. The controller performs error correction, wear leveling, logical-to-physical address translation and bad-block management, allowing users to simplify system development.

All four devices are compliant with JEDEC UFS Ver 2.1, including HS-GEAR3, which has a theoretical interface speed of up to 5.8 Gbps per lane (x2 lanes = 11.6 Gbps) while also suppressing any increase in power consumption. Sequential read and write performance of the 64 GB device are 900 MB/s and 180 MB/s, while the random read and write performance are around 200% and 185% better, respectively, than those of previous generation devices. Due to its serial interface, UFS supports full duplexing, which enables both concurrent reading and writing between the host processor and UFS device.

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