Toshiba Unveils Embedded NAND Flash Memory Products for Automotive Applications

by Hilbert Hagedoorn on: 12/12/2017 08:50 AM | source: | 0 comment(s)

Toshiba today announced that it has begun shipping samples of embedded NAND flash memory products for automotive applications that are compliant with JEDEC UFS version 2.1.

The new products meet AEC-Q100 Grade2 requirements and support a wide temperature range of -40°C to +105°C, offering the enhanced reliability capabilities that are required by increasingly complex automotive applications. The line-up meets a broad range of applications requirements with five different capacities: 16 GB, 32 GB, 64 GB, 128 GB and 256 GB.

The new products are embedded NAND flash memory products that integrate NAND chips fabricated with 15 nm process technology and a controller in a single package. Storage requirements for automotive applications continue to increase as systems including automotive information & entertainment systems and ADAS become more sophisticated, and UFS supports their high performance and density needs. The addition of automotive UFS expands Toshiba Memory Corporation's line-up of embedded NAND flash memory products for automotive applications, which currently includes automotive e-MMC products. Utilizing the UFS interface allows the new products to achieve sequential read of 850 MB/s and random read of 50,000 IOPS, which are approximately 2.7 times and 7.1 times faster than their current e-MMC counterparts, respectively.

Other new functions specifically suited to automotive applications have been added to the new UFS products, including Refresh, Thermal Control and Extended Diagnosis. Refresh can be used to refresh data stored in the UFS and can contribute to the extension of the data's life span. Thermal Control protects against overheating in the high temperatures that can occur in automotive applications. Extended Diagnosis helps users to understand the condition of the product.


Interface		JEDEC UFS V2.1 standard HS-G3 interface
Capacity		16GB, 32GB, 64GB, 128GB, 256GB
Power Supply Voltage		2.7-3.6V (Memory core) 1.7V-1.95V (Interface)
Temperature Range		-40oC to +105oC


Product Name	Capacity	Package		Sample Date
THGAF9G7L1LBAB7	16GB	153Ball FBGA	11.5x13.0x1.0mm	Dec. 2017
THGAF9G8L2LBAB7	32GB	153Ball FBGA	11.5x13.0x1.0mm	Dec. 2017
THGAF9G9L4LBAB8	64GB	153Ball FBGA	11.5x13.0x1.2mm	Dec. 2017
THGAF9T0L8LBAB8	128GB	153Ball FBGA	11.5x13.0x1.2mm	Dec. 2017
THGAF9T1LBLBABY	256GB	169Ball FBGA	12.0x16.0x1.6mm	2Q, 2018 (Apr. - Jun.)

Toshiba Memory Corporation's UFS products have been used to boost overall system performance in mobile devices, and the introduction of automotive UFS products is expected to have a similarly positive impact on the development of automotive information & entertainment systems and ADAS. Toshiba Memory Corporation is already in discussion with major automobile makers on the possibility of implementing the new line-up in next-generation projects. As the storage requirements for automotive applications continue to grow, Toshiba Memory Corporation will continue to lead the market by reinforcing its lineup of high-performance, high-density memory solutions targeting the sector.

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