Intel has introduced another 300 chipset for socket LGA 1151. The B365 seems to resemble the Z170 and H270 more than the B360. In November the B365 already appeared in the rumor mill.
We explained already that Intel has been moving 14nm production towards the 22-nm process. With the change from 14 to 22 nm Intel wants to create capacity for 14nm-CPUs. The B365 has a total of 20 PCI-Express 3.0 lanes and a maximum of 14 USB ports, the B360 has 12. The B360 supports USB 3.1 at 10 Gbps and Wi-Fi (integrated). All chipsets have a TDP of 6 watts, even the manufactured at 14 nm.
| Chipset | B360 | B365 | H370 |
|---|---|---|---|
| Code Name | Coffee Lake | Kaby Lake | Coffee Lake |
| Bus Speed | 8 GT/s DMI3 | 8 GT/s DMI3 | 8 GT/s DMI3 |
| TDP | 6 W | 6 W | 6 W |
| Supports Overclocking | No. | No. | No. |
| PCI Express Configurations | x1, x2, x4 | x1, x2, x4 | x1, x2, x4 |
| PCI Express 3.0 Lanes | 12 | 20 | 20 |
| USB | up to 6 x USB 3.1 Gen 1 up to 4 x USB 3.1 Gen 2 |
8 x USB 3.0 | up to 8 x USB 3.1 Gen 1 up to 4 x USB 3.1 Gen 2 |
| SATA 6.0 Gb / s | 6 | 6 | 6 |
| RAID Configuration | N/A | PCIe 0.1.5 SATA 0.1.5.10 |
PCIe 0.1.5 SATA 0.1.5.10 |
| CPU PCIe Configuration | 1x16 | 1x16 | 1x16 |
| Integrated Wireless | Intel Wireless-AC MAC | N/A | Intel Wireless-AC MAC |
| Intel ME Firmware Version | 12 | 11 | 12 |
