Decapitate a Core i9 9900K apply an OC-Frame, and cool it better
As you all know by now, the 9000 Series Core processors (9900K review), have a soldered heatspreader. Despite that really difficult to remove heat spreader, an OC-Frame has been released offering the option of running that Intel CPU without that metal cover, apply some liquid cooling and tweak moar!
German overclocking specialist Hartung (der8auer) introduced a new OC frame for Intel processors of the 9th Gen like the Core i9-9900K. The new anodized aluminum frame is only suitable for the processor series based on socket LGA 1151 v2 and reduces the temperatures of the chips when applying suitable cooling.
In order to use the OC-Frame, the CPU must first be decapitated, that protective metal cover must be removed. In the 9th Gen Intel soldered the heat spreader for the first time in years again, the Indium used is inferior to a liquid metal paste, and completely without IHS, the chip will get a few extra degrees cooler. This is important because to drive all eight cores to more than 5 GHz, more than 200 watts are necessary, this waste heat is relatively difficult to dissipate due to the small dies.
The aluminum frame is anodized not for the optics, but for the simple fact that it does not conduct electricity, also liquid metal paste cannot corrode the OC frame. With older chips, such as the Core i7-8700K (test) , this type of cooling is incompatible. Those who use the OC-Frame with a 9th Gen Core, should be really careful: Most AiO or water coolers such as EK models are compatible, with air coolers it gets trickier because the CPU without Heatspreader is about 2 mm flatter.
According to Hartung, the temperature is about 4 to 10 Kelvin lower compared to the original state due to the better heat transfer, but according to the overclocking this depends heavily on the respective processor and the precise distribution of the liquid metal paste. The Intel 9th Gen OC-Frame is sold for 30 euros at Caseking.
Senior Member
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Intel switches back to solder - OCers still delid... xD
Senior Member
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Because they did a shit soldering work
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No, because they thickened silicon above transistors. And that has higher thermal resistance than indium solder.
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I'm confused on why this wouldn't work with an 8700k. The article just kind of throws it in there with the material of the bracket. They're both the same sockey with the same sized silicone. Why is it incompatible now?
Senior Member
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Should be noted that he actually decapitated silicon itself. After removal of IHS and clearing, tests were really not that great as intel is using thicker silicon on top of transistors.
So he grind off 0.1 mm or so from die.