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Guru3D Rig of the Month - May 2019
Decapitate a Core i9 9900K apply an OC-Frame, and cool it better
As you all know by now, the 9000 Series Core processors (9900K review), have a soldered heatspreader. Despite that really difficult to remove heat spreader, an OC-Frame has been released offering the option of running that Intel CPU without that metal cover, apply some liquid cooling and tweak moar!
German overclocking specialist Hartung (der8auer) introduced a new OC frame for Intel processors of the 9th Gen like the Core i9-9900K. The new anodized aluminum frame is only suitable for the processor series based on socket LGA 1151 v2 and reduces the temperatures of the chips when applying suitable cooling.
In order to use the OC-Frame, the CPU must first be decapitated, that protective metal cover must be removed. In the 9th Gen Intel soldered the heat spreader for the first time in years again, the Indium used is inferior to a liquid metal paste, and completely without IHS, the chip will get a few extra degrees cooler. This is important because to drive all eight cores to more than 5 GHz, more than 200 watts are necessary, this waste heat is relatively difficult to dissipate due to the small dies.
The aluminum frame is anodized not for the optics, but for the simple fact that it does not conduct electricity, also liquid metal paste cannot corrode the OC frame. With older chips, such as the Core i7-8700K (test) , this type of cooling is incompatible. Those who use the OC-Frame with a 9th Gen Core, should be really careful: Most AiO or water coolers such as EK models are compatible, with air coolers it gets trickier because the CPU without Heatspreader is about 2 mm flatter.
According to Hartung, the temperature is about 4 to 10 Kelvin lower compared to the original state due to the better heat transfer, but according to the overclocking this depends heavily on the respective processor and the precise distribution of the liquid metal paste. The Intel 9th Gen OC-Frame is sold for 30 euros at Caseking.
BLEH!
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#5619608 Posted on: 12/21/2018 03:22 PM
Intel switches back to solder - OCers still delid... xD
Intel switches back to solder - OCers still delid... xD
Picolete
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#5619612 Posted on: 12/21/2018 03:30 PM
Because they did a shit soldering work
Intel switches back to solder - OCers still delid... xD
Because they did a shit soldering work
Fox2232
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#5619615 Posted on: 12/21/2018 03:50 PM
No, because they thickened silicon above transistors. And that has higher thermal resistance than indium solder.
Because they did a crap soldering work
No, because they thickened silicon above transistors. And that has higher thermal resistance than indium solder.
Derek kulp
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#5619644 Posted on: 12/21/2018 05:12 PM
I'm confused on why this wouldn't work with an 8700k. The article just kind of throws it in there with the material of the bracket. They're both the same sockey with the same sized silicone. Why is it incompatible now?
I'm confused on why this wouldn't work with an 8700k. The article just kind of throws it in there with the material of the bracket. They're both the same sockey with the same sized silicone. Why is it incompatible now?
schmidtbag
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#5619645 Posted on: 12/21/2018 05:13 PM
Really? Kelvin? Why is Hartung is patronizing his customers with stupid marketing fluff? Celsius is the same scale and actually makes sense to people.
According to Hartung, the temperature is about 4 to 10 Kelvin lower compared to the original stat
Really? Kelvin? Why is Hartung is patronizing his customers with stupid marketing fluff? Celsius is the same scale and actually makes sense to people.
Agent-A01
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#5619651 Posted on: 12/21/2018 05:21 PM
It it not compatible simply because the actual die's height has basically doubled as well as the substrate being a different thickness.
I'm confused on why this wouldn't work with an 8700k. The article just kind of throws it in there with the material of the bracket. They're both the same sockey with the same sized silicone. Why is it incompatible now?
It it not compatible simply because the actual die's height has basically doubled as well as the substrate being a different thickness.
hearnia_2K
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#5619669 Posted on: 12/21/2018 06:09 PM
What is the point of this product? Why bother with the frame? Just put the cooler on after delidding the CPU. So long as you put it on properly, and straight/flat, and tighten it gradually and evenly there should be no problem.
The frame seems like a waste of money.
What is the point of this product? Why bother with the frame? Just put the cooler on after delidding the CPU. So long as you put it on properly, and straight/flat, and tighten it gradually and evenly there should be no problem.
The frame seems like a waste of money.
vbetts
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#5619670 Posted on: 12/21/2018 06:16 PM
What is the point of this product? Why bother with the frame? Just put the cooler on after delidding the CPU. So long as you put it on properly, and straight/flat, and tighten it gradually and evenly there should be no problem.
The frame seems like a waste of money.
Stops you from putting too much pressure directly on die.
Basically it's a guide for mounting.
What is the point of this product? Why bother with the frame? Just put the cooler on after delidding the CPU. So long as you put it on properly, and straight/flat, and tighten it gradually and evenly there should be no problem.
The frame seems like a waste of money.
Stops you from putting too much pressure directly on die.
Basically it's a guide for mounting.
Ssateneth
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#5619674 Posted on: 12/21/2018 06:31 PM
What is the point of this product? Why bother with the frame? Just put the cooler on after delidding the CPU. So long as you put it on properly, and straight/flat, and tighten it gradually and evenly there should be no problem.
The frame seems like a waste of money.
The frame is multi-purpose. You screw it into the board, so it acts like the clamshell part of the mounting mechanism where it presses the CPU down into the socket evenly.
It acts as a shim so any pressure that isn't directly down will press against the frame instead of a corner of the CPU die, which could break it.
Since you are not pressing down on the die to maintain pressure with socket pins, this is safer. Without the frame, you will bend the CPU because all the mounting pressure is centered directly on the CPU die instead of the PCB itself.
What is the point of this product? Why bother with the frame? Just put the cooler on after delidding the CPU. So long as you put it on properly, and straight/flat, and tighten it gradually and evenly there should be no problem.
The frame seems like a waste of money.
The frame is multi-purpose. You screw it into the board, so it acts like the clamshell part of the mounting mechanism where it presses the CPU down into the socket evenly.
It acts as a shim so any pressure that isn't directly down will press against the frame instead of a corner of the CPU die, which could break it.
Since you are not pressing down on the die to maintain pressure with socket pins, this is safer. Without the frame, you will bend the CPU because all the mounting pressure is centered directly on the CPU die instead of the PCB itself.
chispy
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#5619696 Posted on: 12/21/2018 07:32 PM
Been playing ( Binning ) with lots of 9900k lately ( finally found me a Golden one
1.17v 5.0Ghz chip ) and this chips indeed runs hot , but deliding it's not worth it as it gives you give or take ~4c better temperatures onced delid and liquid metal applied , right there you loose your warranty for a mere 4c better temps. Sanding down the die it's a big no no also as the cpu silicon becomes too fragile and even a big air cooler or too tight water block will brake or crack the die , it's been happening in the extreme LN2 overclockers scene a lot. If anyone wants to try this please be very careful.
In my opinion it's a lot better to leave it as is , just get the best air cooler you can get or better yet water cooling for this cpu. The problem lies in the thickness of the die and silicon itself for heat transfer.
Been playing ( Binning ) with lots of 9900k lately ( finally found me a Golden one
1.17v 5.0Ghz chip ) and this chips indeed runs hot , but deliding it's not worth it as it gives you give or take ~4c better temperatures onced delid and liquid metal applied , right there you loose your warranty for a mere 4c better temps. Sanding down the die it's a big no no also as the cpu silicon becomes too fragile and even a big air cooler or too tight water block will brake or crack the die , it's been happening in the extreme LN2 overclockers scene a lot. If anyone wants to try this please be very careful.In my opinion it's a lot better to leave it as is , just get the best air cooler you can get or better yet water cooling for this cpu. The problem lies in the thickness of the die and silicon itself for heat transfer.
Bo Alenkaer
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#5619761 Posted on: 12/22/2018 01:21 AM
I’m sure the frame does provide pressure for better contact. My best goes would be that it might slightly bend in the middle and the outer pins might lose contact
I’m sure the frame does provide pressure for better contact. My best goes would be that it might slightly bend in the middle and the outer pins might lose contact
Jayp
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#5619789 Posted on: 12/22/2018 05:14 AM
Should be noted that he actually decapitated silicon itself. After removal of IHS and clearing, tests were really not that great as intel is using thicker silicon on top of transistors.
So he grind off 0.1 mm or so from die.
He actually did a lot of testing. In his video on this product he only removed the soldier nothing further. Also I am not sure what you mean by not that great. Depending on what 9th gen CPU you're using he said 4-10C below an already delidded and liquid metal equipped CPU. The lower being on 9600K. 9700K and 9900K could see 12-18c difference from stock to direct die with liquid metal. That's a massive difference especially for those wanting to push the 9900K.
Should be noted that he actually decapitated silicon itself. After removal of IHS and clearing, tests were really not that great as intel is using thicker silicon on top of transistors.
So he grind off 0.1 mm or so from die.
He actually did a lot of testing. In his video on this product he only removed the soldier nothing further. Also I am not sure what you mean by not that great. Depending on what 9th gen CPU you're using he said 4-10C below an already delidded and liquid metal equipped CPU. The lower being on 9600K. 9700K and 9900K could see 12-18c difference from stock to direct die with liquid metal. That's a massive difference especially for those wanting to push the 9900K.
Jayp
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#5619790 Posted on: 12/22/2018 05:22 AM
What is the point of this product? Why bother with the frame? Just put the cooler on after delidding the CPU. So long as you put it on properly, and straight/flat, and tighten it gradually and evenly there should be no problem.
The frame seems like a waste of money.
This bracket serves the same purpose as Intel stock CPU clamp. Holds the CPU securely in the socket so that no weird movement causes damaged pins/socket. Sure you don't have to get it but I like that he made it.
What is the point of this product? Why bother with the frame? Just put the cooler on after delidding the CPU. So long as you put it on properly, and straight/flat, and tighten it gradually and evenly there should be no problem.
The frame seems like a waste of money.
This bracket serves the same purpose as Intel stock CPU clamp. Holds the CPU securely in the socket so that no weird movement causes damaged pins/socket. Sure you don't have to get it but I like that he made it.
SweenJM
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#5619811 Posted on: 12/22/2018 09:36 AM
Seems like something you would only really want to do if you were running LN2 and every degree counted.
Seems like something you would only really want to do if you were running LN2 and every degree counted.
Click here to post a comment for this news story on the message forum.
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Should be noted that he actually decapitated silicon itself. After removal of IHS and clearing, tests were really not that great as intel is using thicker silicon on top of transistors.
So he grind off 0.1 mm or so from die.