AMD Introduces the High-Efficiency Ryzen Embedded 5000 Series for Security and Networking Solutions

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Complementing AMD's "Zen 3"-based embedded processor range, the Ryzen Embedded 5000 Series joins the Ryzen Embedded V3000 and EPYC Embedded 7000 series families.



AMD has unveiled its high-performance Ryzen Embedded 5000 Series processors, designed to cater to the needs of customers requiring energy-efficient solutions for "always on" networking firewalls, network-attached storage systems, and various security applications.  

Constructed with 7 nm technology and a projected five-year manufacturing availability, the Ryzen Embedded 5000 Series processors feature 6, 8, 12, or 16 cores and 24 lanes of PCIe Gen 4 connectivity. These processors ensure enterprise-grade reliability to meet the consistent uptime demanded by security and networking clients. The Ryzen Embedded 5000 Series offers a comprehensive suite of reliability, availability, and serviceability (RAS) capabilities, including an ECC-supported memory subsystem. With thermal design power (TDP) profiles ranging from 65 W to 105 W, the processors facilitate a reduction in overall system cooling footprint for space-limited and budget-conscious applications.

 

Ryzen Embedded 5000 Series Processor Product Chart

Model CPU Cores Threads count CPU Base Freq (GHz) CPU 1T Boost Freq (up to GHz1) L3 CPU Cache (MB) Nominal TDP (W) DDR4 Channels Max DDR4 rate (MT/s) (1DPC) PCIe® Gen 43 Lanes Socket
5950E 16 32 3.05 3.4 64 105 2 3200 24 AM4
5900E 12 24 3.35 3.7 64 105 2 3200 24 AM4
5800E 8 16 3.4 3.7 32 102 2 3200 24 AM4
5600E 6 12 3.3 3.6 32 65 2 3200 24 AM4

 

1Max boost for Ryzen Embedded 5000 processors is the maximum frequency achievable by any single core on the processor under normal operating conditions for enterprise systems.
2Ryzen Embedded 5800E processor supports configurable Thermal Design Power (cTDP) from 65W to 100W.
3Ryzen Embedded 5000 processors support a total of 24 lanes of PCIe® Gen4. Optionally paired with the AMD X570 Chipset, up to 36 lanes of PCIe® Gen4 can be supported.

Rajneesh Gaur, Corporate Vice President & General Manager of AMD's Embedded Solutions Group, said, "Ryzen Embedded 5000 processors provide the perfect fusion of performance and dependability for 24x7 security and networking applications." He added that the expansion of AMD's embedded product portfolio "offers a mid-range solution that bridges the gap between our low-power BGA Ryzen Embedded and our top-tier EPYC embedded family for clients who require both high-performance and scalability of up to 16 cores."

Kevin Krewell, Principal Analyst at TIRIAS Research, observed that AMD's success in the embedded market is attributable to its "differentiated and scalable offerings addressing a diverse range of applications with varying power, performance, and environmental requirements." He stated that the Ryzen Embedded 5000 Series achieves "an ideal balance of power and performance for applications spanning from small-form factor embedded systems to storage, security, and networking systems, catering to the widest range of customers and use cases."

Features of the Ryzen Embedded 5000 Series processors include:

  • Scalability up to 16 cores and 32 threads
  • Up to 64 MB shared L3 CPU Cache
  • Energy-efficient TDP profiles from 65 W to 105 W
  • ECC-supported memory and security capabilities
  • 24 lanes of PCIe 4 connectivity (expandable I/O up to 36 lanes with AMD X570 chipset)
  • Performance optimization for enterprise reliability

AMD's Ryzen Embedded 5000 Series processors are currently in production with a planned five-year manufacturing availability.

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