Silicon Power announces the new Xpower DDR3 overclocking series memory module. Complete with dual (2GBx2) and tri-channel (2GBx3) packs, it is available in DDR3-1600, 1800, 2000, 2133 MHz variants.
Completely compatible with Intel quad-core Core i5 and Core i7 platforms, Xpower DDR3 modules use ?goblique groove manufacturing process?h and pure aluminum heat sink to resolve heat dissipation issues. In addition, Xpower DDR3 applies 1.65V to maintain high speed and stability to meet the needs of enthusiasts and gamers.
The oblique groove heat sink design of Silicon Power?fs Xpower DDR3 overclocking series increases the heat dissipation area of the heat sink and can provide up to twice the heat dissipation ability over standard heat sinks. In addition, the Xpower DDR3 series use 8-layered PCBs and new fly-by topology design for more efficient commands, addresses, control signals, and clocks signals. It also supports On-DIE Termination (ODT) to dramatically reduce unwanted reflection signals and maximize speed. Silicon Power insists on using original memory modules and FBGA packaging for better heat dissipation and accurate data transfer.
Product specifications:
New generation of heat sink featuring ultra efficient heat dissipation
Status / temperature |
Xpower DDR3 |
General DDR3 |
Windows XP in idle mode |
31? |