MediaTek Unveils Dimensity 9200+ Chipset for Flagship 5G Smartphones

Published by


MediaTek, a leading semiconductor manufacturer, has launched the new Dimensity 9200+ chipset as an addition to its Dimensity portfolio. The chipset is designed for flagship 5G smartphones.

Mediatek has launched its latest System-on-Chip (SoC), the Dimensity 9200+, which is manufactured by TSMC's second-generation 4nm process. The SoC is based on the Dimensity 9200 and comes with enhanced performance. The CPU features an 8-core configuration of Cortex-X3 (up to 3.35 GHz) x 1 + Cortex-A715 (up to 3.0 GHz) x 3 + Cortex-A510 (up to 2.0 GHz) x 4, all with increased clock speeds. Benchmark tests show a 10% improvement in single-core performance and a 5% improvement in multi-core performance compared to the Dimensity 9200.

The GPU of the Dimensity 9200+ comes with an 11-core Immortalis-G715 GPU that supports hardware-based ray tracing, and is said to be 17% faster. It also features "HyperEngine 6.0" that can minimize delays while maintaining a high frame rate, and supports variable rate shading. The SoC includes the "MediaTek MiraVision 890" which supports adaptive refresh rate technology and motion blur reduction function. Similar to the Dimensity 9200, the 6th generation "APU 690" is integrated as an AI processing unit. The modem is equipped with 4CC-CA 5G Release-16, enabling a seamless 5G experience while switching smoothly between long-distance Sub-6 and high-speed mmWave communication.

The wireless network supports Bluetooth 5.3 and Wi-Fi 7 2 x 2 + 2 x 2 with a maximum rate of 6.5 Gbps. Battery life is also improved with "MediaTek 5G UltraSave 3.0" that optimizes battery life for all 5G connection conditions.

The Dimensity 9200+ is equipped with a 4CC-CA 5G Release-16 modem that seamlessly switches between long-reach sub-6GHz and super-fast mmWave connections. The chipset also supports Wi-Fi 7 2x2 + 2x2 with up to 6.5 Gbps data rate, as well as Bluetooth 5.3. MediaTek's Bluetooth and Wi-Fi coexistence technology enables Wi-Fi, Bluetooth low energy (LE) audio, and wireless peripherals to connect at the same time without interference and extremely low latency.

The Dimensity 9200+ is an excellent choice for gamers and power users who require high-performance devices. The chipset will be available for flagship 5G smartphones soon.

Key features of the MediaTek Dimensity 9200+ include:

  • HyperEngine 6.0: Further improving the gaming experience with adaptive performance technology capable of sustaining high framerates and minimizing latency.
  • Second generation TSMC 4nm-class process: Ideal for ultra-slim designs in a variety of form factors.
  • Sixth generation AI Processing Unit (APU 690): Efficiently powers AI-noise reduction and AI-super resolution tasks, and creates truly cinematic video through real-time focus and Bokeh adjustments.
  • MediaTek Imagiq 890: Powerful flagship image signal processor that supports captivating capture, providing bright, sharp images and videos even in low-light scenarios.
  • MediaTek MiraVision 890: Display technology with adaptive refresh rate technology and motion blur reduction for a fluid user experience.
  • MediaTek 5G UltraSave 3.0: Power efficiency technologies to optimize battery life for all 5G connection conditions.
  • Smartphones powered by the MediaTek Dimensity 9200+ are expected to be released in May 2023.

Share this content
Twitter Facebook Reddit WhatsApp Email Print