FSP to Unveil New Power Supplies, Cases, and Cooling Solutions

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FSP Group, a globally recognized ODM specializing in high-performance power supplies and PC components, has announced its participation in COMPUTEX Taipei 2024, slated for June 4-7 at the Taipei Nangang Exhibition Center. The company is set to introduce a comprehensive lineup of products, including new power supply units (PSUs), PC cases, and cooling solutions designed to meet the demands of modern PC users. FSP will spotlight its newly developed VITA, ADVAN, and MEGA series PSUs at the event. The VITA series is engineered for budget-conscious builders, offering power efficiency ratings from Bronze to Gold. These units are designed with high-quality bulk capacitors to ensure reliability and longevity, supporting a variety of system configurations while maintaining cost-efficiency. Some models in this series also feature a silent fan technology to minimize noise without sacrificing cooling performance.

The ADVAN series is targeted at both gamers and professionals. It offers Bronze, Gold, and Platinum efficiency ratings, catering to the needs of mainstream gaming rigs and professional workstations. This series features a semi-fanless design in select models, ensuring quiet operation under low-load conditions. The ADVAN series is also equipped with robust voltage protection and a smart cable management system, enhancing both the aesthetic and functional aspects of the units.

For high-performance applications, the MEGA series provides options ranging from 1000 W to 1650 W, with designs that achieve up to Titanium efficiency. The flagship MEGA TI 1650 W model is designed for demanding gaming setups and overclocked systems, featuring Fluid Dynamic Bearing (FDB) fans for effective and quiet cooling and a conformal coating for added durability in harsh conditions.


In addition to PSUs, FSP will also unveil a range of advanced PC cases at COMPUTEX. The FSP U700 AI Workstation case is designed specifically for artificial intelligence computing, supporting dual power supplies and multi-GPU configurations which are crucial for AI model training. This case, combined with the FSP CANNON PRO 2500 W power supply, offers enhanced reliability and efficiency for intensive AI applications.

The gaming-oriented cases, including the U690, M580, and S380 models, feature innovative designs with panoramic or three-sided glass panels, catering to gamers who value both aesthetics and functionality. These cases are engineered for effective heat dissipation and support various liquid cooling systems, ensuring optimal performance during intensive gaming sessions.


FSP is also set to introduce a new range of CPU cooling solutions, including air coolers and All-In-One (AIO) liquid coolers. The air cooler models—NE5, NP5, ME7, and MP7—are designed to provide excellent thermal management and noise control. The AIO coolers, available in 240 mm and 360 mm configurations, are tailored for high Thermal Design Power (TDP) systems, featuring optimized mounting kits for easy installation and compatibility with most contemporary CPUs.

FSP's showcase at COMPUTEX Taipei 2024 aims to demonstrate its continued commitment to innovation and quality in developing state-of-the-art PC components. Visitors to the event are invited to explore FSP's latest offerings at Nangang Hall 1, Floor 4, booth no: L1209a, where they can experience the future of PC power supply and cooling technologies firsthand.

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