AMD Zen Summit Ridge Die says Hello

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Over at SemiAccurate they spotted something interesting, it seems to be the AMD Zen Summit Ridge Die as AMD seems to have accidentally outed a rendering of the wafer at its May 12th shareholders meeting.

Summit Ridge is the high-end desktop (HEDT) product that AMD has previously promised to release in Q4 of this year. It’s expected to be the first chip that integrates AMD upcoming Zen CPU architecture.  Expectations are high and Summit Ridge may prove to be a make or break product for AMD.

The "Summit Ridge" Zen family will feature a unified AM4 socket with its GPU-equipped "Bristol Ridge" APU counterparts, and feature DDR4 support and a 95W TDP.  While newer roadmaps don't confirm the TDP for desktop products, they suggest a range for low-power mobile products with up to two Zen cores from 5 to 15W and 15 to 35W for performance-oriented mobile products with up to four Zen cores.

Each Zen core will have four integer units, two address generation units and four floating point units, and the decoder can decode four instructions per clock cycle. L1 data cache size is 32 KiB and L2 cache size 512 KiB per core. Two of the floating point units are adders, two are multipliers.

See the wafer shot below ... 

AMD Zen Summit Ridge Die says Hello

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