SK hynix Announces HBM3 DRAM Development
SK hynix Inc. announced that it has become the first in the industry to successfully develop the High Bandwidth Memory 3, the world's best-performing DRAM. HBM3, the fourth generation of the HBM technology with a combination of multiple DRAM chips vertically connected, is a high value product that innovatively raises the data processing rate.
The latest development, which follows the start of mass production of HBM2E in July last year, is expected to help consolidate the company's leadership in the market. SK hynix was also the first in the industry to start mass production of HBM2E. SK hynix's HBM3 is not only the fastest DRAM in the world, but also comes with the biggest capacity and significantly improved level of quality.
The latest product can process up to 819 GB (Gigabyte) per second, meaning that 163 FHD (full-HD) movies (5 GB each) can be transmitted in a single second. This represents a 78% increase in the data-processing speed compared with the HBM2E. It also corrects data (bit) errors with the help of the built-in on-die error-correction code, significantly improving the reliability of the product.
SK hynix's HBM3 will be provided in two capacity types of 24 GB - the industry's biggest -- and 16 GB. For the 24 GB product, SK hynix engineers ground the height of a DRAM chip to approximately 30 micrometer, equivalent to a third of an A4 paper's thickness, before vertically stacking 12 chips using the through silicon via technology.
HBM3 is expected to be mainly adopted by high-performance data centers as well as machine learning platforms that enhance the level of artificial intelligence and super computing performance used to conduct climate change analysis and drug development.
"Since its launch of the world's first HBM DRAM, SK hynix has succeeded in developing the industry's first HBM3 after leading the HBM2E market," said Seon-yong Cha, Executive Vice President in charge of the DRAM development. "We will continue our efforts to solidify our leadership in the premium memory market and help boost the values of our customers by providing products that are in line with the ESG management standards."
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Senior Member
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So, does this imply they'll be on DIMMs?
Also, with upcoming servers having DDR5 and 12 memory channels, how much more bandwidth is really necessary to justify the cost of HBM3? Keep in mind too Samsung will be releasing 512GB modules for DDR5, so HBM3 capping at 24GB seems rather... unimpressive for a server.
HBM to me makes a whole lot more sense for APUs, where there aren't many memory channels and you don't need TB of memory, but there is a desperate need for more bandwidth.
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So, does this imply they'll be on DIMMs?
Also, with upcoming servers having DDR5 and 12 memory channels, how much more bandwidth is really necessary to justify the cost of HBM3? Keep in mind too Samsung will be releasing 512GB modules for DDR5, so HBM3 capping at 24GB seems rather... unimpressive for a server.
HBM to me makes a whole lot more sense for APUs, where there aren't many memory channels and you don't need TB of memory, but there is a desperate need for more bandwidth.
HBM3 is probably aimed at the high end GPU market and not intended as a RAM type for general purpose RAM. If I'm not mistaken the 24GB cap is per stack and most solutions that would use HBM3 will use multiple stacks.
For instance the A100 cards we use here have 5 stacks of 8GB HBM2 RAM (technically 6, but one is disabled for yield reasons) for a total of 40GB. There is now a variant of the A100 that uses 16 GB stacks of HBM2E memory for a total of 80 GB.
So future high end GPU's might deploy with 5 stacks of 24 GB HBM3 memory or 120 GB of VRAM!
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HBM3 is probably aimed at the high end GPU market and not intended as a RAM type for general purpose RAM. If I'm not mistaken the 24GB cap is per stack and most solutions that would use HBM3 will use multiple stacks.
For instance the A100 cards we use here have 5 stacks of 8GB HBM2 RAM (technically 6, but one is disabled for yield reasons) for a total of 40GB. There is now a variant of the A100 that uses 16 GB stacks of HBM2E memory for a total of 80 GB.
So future high end GPU's might deploy with 5 stacks of 24 GB HBM3 memory or 120 GB of VRAM!
Yeah I suppose you're right. Re-reading the article, I'm not sure where I was getting the impression that I thought this was just going to be for desktop CPUs. But yeah for GPUs, this could be great.
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@Crazy Joe i agree on an apu hbm will be insanely good .... The problem is that it is to expensive to say stick a chip to 5600g for the price range of the cpu , witch is a shame

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HBM has such high promises, but sadly it's just too expensive.