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Guru3D.com » News » Intel Embedded Multi-Die Interconnect Bridge - EMIB

Intel Embedded Multi-Die Interconnect Bridge - EMIB

by Hilbert Hagedoorn on: 11/27/2019 09:51 AM | source: | 4 comment(s)
Intel Embedded Multi-Die Interconnect Bridge - EMIB

Most chips in today’s smartphones, computers and servers are comprised of multiple smaller chips invisibly sealed inside one rectangular package. How do these multiple chips — often including CPU, graphics, memory, IO and more communicate?

-- Intel -- An Intel innovation called EMIB (embedded multi-die interconnect bridge) is a complex multi-layered sliver of silicon no bigger than a grain of rice. It lets chips fling enormous quantities of data back and forth among adjoining chips at blinding speeds: several gigabytes per second.

Today, Intel EMIBs speed the flow of data inside nearly 1 million laptops and field programmable gate array devices worldwide. That number will soon soar and include more products as EMIB technology enters the mainstream. For example, Intel’s Ponte Vecchio processor, a general-purpose GPU the company unveiled Nov. 17, contains EMIB silicon. To meet customers’ unique needs, this innovative technology allows chip architects to cobble together specialized chips faster than ever. And compared with an older, competing design called an interposer — in which chips inside a package sit atop what is essentially a single electronic baseboard, with each chip plugged into it — tiny, flexible, cost-effective EMIB silicon offers an 85% increase in bandwidth. That can make your tech — laptop, server, 5G processor, graphics card— run dramatically faster. And next-generation EMIB could double or even triple that bandwidth.

Below a photo of EMIB.



Intel Embedded Multi-Die Interconnect Bridge - EMIB




« ASUS ROG Zenith II Extreme Launches · Intel Embedded Multi-Die Interconnect Bridge - EMIB · AMD Ryzen 9 3950X and 3rd Gen Threadripper are Hard To Get Processors »

Kaarme
Senior Member



Posts: 3363
Joined: 2013-03-10

#5735500 Posted on: 11/27/2019 01:08 PM
Previously, Intel only experimented with the rice grain, but couldn't make chiplets communicate with each other through the piece of cereal. Thus, we were stuck with four cores max, in mainstream, for years. Only recently, inspired by AMD, Intel realised a rice grain won't work and came up with this silicon solution.

icedman
Senior Member



Posts: 1245
Joined: 2013-02-22

#5735510 Posted on: 11/27/2019 02:17 PM
^haha it's sad but that's what it seems like.
It's good to finally see better pricing and some actual advancement from intel again tho, my last 3 systems I've built for my house hold have all been AMD and if intel doesnt bring anything soon the next will also be AMD they just have the price to performance victory here

Kaotik
Senior Member



Posts: 162
Joined: 2004-12-24

#5735581 Posted on: 11/27/2019 07:55 PM
Previously, Intel only experimented with the rice grain, but couldn't make chiplets communicate with each other through the piece of cereal. Thus, we were stuck with four cores max, in mainstream, for years. Only recently, inspired by AMD, Intel realised a rice grain won't work and came up with this silicon solution.

Fun fact: Kaby Lake-G with AMD Radeon graphics was the first or one of the first products to use EMIB (can't remember whether Stratix 10 FPGA got out before or after)

Venix
Senior Member



Posts: 2985
Joined: 2016-08-01

#5735846 Posted on: 11/28/2019 05:16 PM
That's some fancy glue intel made there !

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