ZEN4 AM5 LGA1718 pin package shown, more PCIe lanes and possible higher TDP

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We've already talked a bit about Socket AM5 and the new LGA Design over the weekend, but Twitter user ExecutableFix now also posted a photo of what the backside of such a processor would look like.



The photo is a mockup of ZEN4 and brings a look as to what the line-grid array (LGA) package would look like. Alongside the photo, he also gives a little more detail, as AMD's 'Raphael' would handle the new memory DDR5 standard. Also, the Zen 4 architecture would get 28 PCIe 4.0 lanes, four more than their predecessors. He also mentions an increased TDP, right now he's listing it at 120W, in the future that could be 170W as a possibility as well perhaps for specific high perf SKUs. 

All this information falls into the realm of rumors though, so please treat them as such.

ZEN4 AM5 LGA1718 pin package shown, more PCIe lanes and possible higher TDP


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