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Guru3D.com » News » Upcoming Ryzen 2.0 (Pinnacle Ridge) Will Get Soldered Heatspreader

Upcoming Ryzen 2.0 (Pinnacle Ridge) Will Get Soldered Heatspreader

by Hilbert Hagedoorn on: 02/15/2018 06:08 PM | source: | 18 comment(s)
Upcoming Ryzen 2.0 (Pinnacle Ridge) Will Get Soldered Heatspreader

If the prognosis remains true, AMD will release the optimized v2.0 of Ryzen (Pinnacle Ridge) processors in April alongside a new X470 chipset. It has now been confirmed that these 2nd gen processors will get a soldered heat spreader, and not one based on thermal paste. 

Earlier this week AMD released Raven Ridge, the Ryzen 2000G series APUs, these actually have thermal paste between the die and heat spreader. Albeit TIM (thermal insulation material) is cheaper to use, it is suggested that they have poorer heat transfer and thus are less efficient to cool down. Pinnacle Ridge, however, will get that heat spreader soldered onto the die, which should be more efficient. AMD also applies this method for example with current Ryzen and Threadripper processors, and let us be honest here; you cannot complain about Ryzen temperatures whatsoever. The news was confirmed by AMDs Robert Hallock, earlier today.

 

 

Overclockers and colder processor aficionado's should like the news, there will be no need for delidding. The upcoming generation Ryzen v2.0 processors, Pinnacle Ridge aka Ryzen 2000 aka Zen+ will be based on an optimized 12nm (12LP) process based on fabrication at Global Foundries which could improve on clock frequency and internal efficiency. 

 

  

While the new v2.0 processors obviously also work with your X370 chipset based motherboard, but yes, there will also be an X470 motherboard chipset launched. The details of what that chipset will offer over the X370 are not yet announced though. In April we'll see 12nm Zen+ optimized Ryzen processors.  Zen 2 is fabbed at 7nm. Zen 3 is on track, launching in 2020 based on a 7nm+ (optimized) fabrication.



Upcoming Ryzen 2.0 (Pinnacle Ridge) Will Get Soldered Heatspreader Upcoming Ryzen 2.0 (Pinnacle Ridge) Will Get Soldered Heatspreader




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TheDeeGee
Senior Member



Posts: 8485
Joined: 2010-08-28

#5521009 Posted on: 02/19/2018 06:19 AM
Depending on the reviews this might make me go back to AMD, after having switched to Intel in 2008.

southamptonfc
Senior Member



Posts: 2500
Joined: 2006-04-10

#5521013 Posted on: 02/19/2018 08:41 AM
The TIM on Raven Ridge was only to save on cost, as the 2200G and 2400G are budget parts and only rated for 65W. For their high-end parts, they will continue to user solder, which is pretty much what was expected - those paying the premium for these chips deserve the best cooling option.


And Skylake-X and Kabylake-X both use TIM, not solder.

Those paying the premium for these chips deserve the best but Intel is not giving it to them.

tunejunky
Senior Member



Posts: 3040
Joined: 2017-08-18

#5521768 Posted on: 02/21/2018 08:16 PM
And Skylake-X and Kabylake-X both use TIM, not solder.

Those paying the premium for these chips deserve the best but Intel is not giving it to them.

i may just cheer for your squad vs. Brighton

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