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Guru3D.com » News » Upcoming Ryzen 2.0 (Pinnacle Ridge) Will Get Soldered Heatspreader

Upcoming Ryzen 2.0 (Pinnacle Ridge) Will Get Soldered Heatspreader

by Hilbert Hagedoorn on: 02/15/2018 06:08 PM | source: | 18 comment(s)
Upcoming Ryzen 2.0 (Pinnacle Ridge) Will Get Soldered Heatspreader

If the prognosis remains true, AMD will release the optimized v2.0 of Ryzen (Pinnacle Ridge) processors in April alongside a new X470 chipset. It has now been confirmed that these 2nd gen processors will get a soldered heat spreader, and not one based on thermal paste. 

Earlier this week AMD released Raven Ridge, the Ryzen 2000G series APUs, these actually have thermal paste between the die and heat spreader. Albeit TIM (thermal insulation material) is cheaper to use, it is suggested that they have poorer heat transfer and thus are less efficient to cool down. Pinnacle Ridge, however, will get that heat spreader soldered onto the die, which should be more efficient. AMD also applies this method for example with current Ryzen and Threadripper processors, and let us be honest here; you cannot complain about Ryzen temperatures whatsoever. The news was confirmed by AMDs Robert Hallock, earlier today.

 

 

Overclockers and colder processor aficionado's should like the news, there will be no need for delidding. The upcoming generation Ryzen v2.0 processors, Pinnacle Ridge aka Ryzen 2000 aka Zen+ will be based on an optimized 12nm (12LP) process based on fabrication at Global Foundries which could improve on clock frequency and internal efficiency. 

 

  

While the new v2.0 processors obviously also work with your X370 chipset based motherboard, but yes, there will also be an X470 motherboard chipset launched. The details of what that chipset will offer over the X370 are not yet announced though. In April we'll see 12nm Zen+ optimized Ryzen processors.  Zen 2 is fabbed at 7nm. Zen 3 is on track, launching in 2020 based on a 7nm+ (optimized) fabrication.



Upcoming Ryzen 2.0 (Pinnacle Ridge) Will Get Soldered Heatspreader Upcoming Ryzen 2.0 (Pinnacle Ridge) Will Get Soldered Heatspreader




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Octopuss
Senior Member



Posts: 867
Joined: 2012-05-14

#5520301 Posted on: 02/15/2018 08:38 PM
AMD might not have the best hardware, but they sure do make good decisions I as a customer like.

waltc3
Senior Member



Posts: 1434
Joined: 2014-07-22

#5520319 Posted on: 02/15/2018 09:42 PM
The TIM on Raven Ridge was only to save on cost, as the 2200G and 2400G are budget parts and only rated for 65W. For their high-end parts, they will continue to user solder, which is pretty much what was expected - those paying the premium for these chips deserve the best cooling option.


Yep, from what I've read it's only Intel using paste on their cpus, unless they've changed that in response to AMD going solder with Ryzen cpus. (2xxx G's are APUs, not technically cpus... ;))

Fox2232
Senior Member



Posts: 11808
Joined: 2012-07-20

#5520333 Posted on: 02/15/2018 10:22 PM
I just hope there is one X470 mATX board with one PCI slot at launch time.

D3M1G0D
Senior Member



Posts: 2068
Joined: 2017-03-10

#5520344 Posted on: 02/15/2018 10:55 PM
Yep, from what I've read it's only Intel using paste on their cpus, unless they've changed that in response to AMD going solder with Ryzen cpus. (2xxx G's are APUs, not technically cpus... ;))

I doubt Intel will ever change on that. As long as their customers are willing to put up with the TIM (and delidding) then they'll continue using it. People vote with their wallets, and every time an Intel CPU (that uses TIM) is sold Intel receives a signal that TIM is acceptable, so why change?

Aura89
Senior Member



Posts: 8372
Joined: 2008-07-31

#5520357 Posted on: 02/15/2018 11:49 PM
I just hope there is one X470 mATX board with one PCI slot at launch time.

Don't bet on it. I predict PCI slots will pretty much be completely phased out in 2-3 years.

If you need it that badly, might think about getting something like this:

https://www.alibaba.com/product-detail/Mini-PCIe-to-2-external-pci-1890717704.html

Though obviously that ends up taking more room and i can only assume you want to take up less room since you want mATX

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