Toshiba Adds BiCS FLASH Enabled UFS to Lineup of Embedded Automotive Memory Products

by Hilbert Hagedoorn on: 03/26/2019 07:56 AM | source: | 0 comment(s)

Toshiba Memory Corporation, the world leader in memory solutions, today announced that it has begun sampling new Automotive JEDEC UFS Version 2.1 embedded memory solutions utilizing 3D flash memory. The new products are embedded flash memory devices that integrate the company's BiCS FLASH 3D flash memory and a controller in a single package.

The sequential read and write performance are improved by approximately 6 percent and 33 percent, respectively, over existing devices.

The company's Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade 2 requirements and offers the enhanced reliability required by various automotive applications. The lineup consists of four capacities: 32GB, 64GB, 128GB, and 256GB.

The new UFS devices feature several functions well-suited to the requirements of automotive applications, including Refresh, Thermal Control and Extended Diagnosis. The Refresh function can be used to refresh data stored in UFS, and helps to extend the data's lifespan. The Thermal Control function protects the device from overheating in the high-temperature circumstances that can occur in automotive applications. Lastly, the Extended Diagnosis function helps users easily understand the device's status.

Interface		JEDEC UFS Version 2.1 standard HS-G3 interface
Capacity		32GB, 64GB, 128GB, 256GB
Power Supply Voltage		2.7V-3.6V (Memory core) 1.70V-1.95V (Interface)
Temperature Range		-40„ƒ to +105„ƒ


Lineup of the New Products
Product Name	Capacity	Package		Sample Availability
THGAFBG8T13BAB7	32GB	153Ball FBGA	11.5 x 13.0 x 1.0mm	2Q (Apr.-Jun.)
THGAFBG9T23BAB8	64GB	153Ball FBGA	11.5 x 13.0 x 1.2mm	Available
THGAFBT0T43BAB8	128GB	153Ball FBGA	11.5 x 13.0 x 1.2mm	Available
THGAFBT1T83BAB5	256GB	153Ball FBGA	11.5 x 13.0 x 1.3mm	Available

Technology advances in automotive information & entertainment systems and ADAS related products for the realization of connected cars and autonomous vehicles will continue to push the storage demands in automotive applications ever higher. As these demands continue to grow, Toshiba Memory Corporation will retain a leadership position in the market by reinforcing its lineup of high-performance, high-capacity memory solutions targeting the sector.

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