SK Hynix Starts Mass-Producing 72-Layer 3D NAND Flash Memories

Good, we need more layered 3D NAND flash as hey, it increases NAND storage sizes, and that will bring production cost long term down. SK Hynix started mass-producing their 4th generation (72-layer) 3D NAND flash wafers and achieved what is called ‘golden yield’.

Its solution product that uses its own controller and firmware passed certifications. Productivity of 72-layer 3D NAND flash memories will be increased by 30% compared to previous method and will be similar to productivity of Samsung Electronics’ 4th generation (64-layer) 3D NAND flash memories, which are being mass-produced starting from June.

SK Hynix’s 3D NAND flash chip is a TLC (Triple Level Cell) product that can save 3 bits per cell. Compared to MLC (Multi Level Cell) products that save 2 bits per cell, TLC has better production cost per capacity. Number of stacks of 72-layer 3D NAND flash memory is 1.5 times higher than 48-layer product, and SK Hynix has improved its productivity by 30% by maximizing its current mass-production plants.

SK Hynix also doubled operation speed by applying fast circuit design inside of a chip and also increased reading and writing abilities by about 20%.

SK Hynix applied its own controller and firmware to TLC NAND-based solutions proves that its competitive edge in related technologies has increased as much.

SK Hynix is currently mass-producing 72-layer NAND flash memories from its M12 plan in Cheongju. It is planning to start mass-producing 3D NAND memories from second floor of M14, which is its new plant in Icheon, during third quarter as well. “We expect that percentage of production of 3D NAND flash memories will exceed 50% at the end of this year.”

Some predict that landscape of global NAND flash memory markets will change as SK Hynix succeeds in mass-producing 72-layer NAND flash memories. A