It has been silent in regards to HBM memory. There has been an intermediate step for hbm2 called hbm2e, but little is known about HBM3. SK Hynix made some announcements sthough. 

HBM is on-package memory, merged towards the say GPU with the help of IO routes and interconnects. We all know the history of HBM and HBM2, HBM2e memory these days already offers a bandwidth of 460 GB/s per stack of chips, good for 3.6 Gbit/s per pin. The maximum capacity of a single hbm2e chip is 16 GB. While hbm3 standard has not yet been fully established, according to the manufacturer's site, such chips are currently under development and will become effective.

SK Hynix mentions that the new memory type can reach a speed of 665 GB/s or greater, which is almost 45% faster than the currently fastest hbm2e memory. The speed per pin is 5.2 Gbit/s, an increase of 44% compared to the 3.6 Gbit/s that hbm2e achieves per pin.