SK Hynix Announces its HBM2E Memory Products, 460 GB/s and 16GB per Stack

by Hilbert Hagedoorn on: 08/12/2019 08:47 AM | source: | 10 comment(s)

SK Hynix Inc. announced today that it has developed HBM2E DRAM product with the industry's highest bandwidth. The new HBM2E boasts approximately 50% higher bandwidth and 100% additional capacity compared to the previous HBM2.

SK Hynix's HBM2E supports over 460 GB (Gigabyte) per second bandwidth based on the 3.6 Gbps (gigabits-per-second) speed performance per pin with 1,024 data I/Os (Inputs/Outputs). Through utilization of the TSV (Through Silicon Via) technology, a maximum of eight 16-gigabit chips are vertically stacked, forming a single, dense package of 16 GB data capacity.

SK Hynix's HBM2E is an optimal memory solution for the fourth Industrial Era, supporting high-end GPU, supercomputers, machine learning, and artificial intelligence systems that require the maximum level of memory performance. Unlike commodity DRAM products which take on module package forms and mounted on system boards, HBM chip is interconnected closely to processors such as GPUs and logic chips, distanced only a few µm units apart, which allows even faster data transfer.

"SK Hynix has established its technological leadership since its world's first HBM release in 2013," said Jun-Hyun Chun, Head of HBM Business Strategy. "SK Hynix will begin mass production in 2020, when the HBM2E market is expected to open up, and continue to strengthen its leadership in the premium DRAM market."

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Aekold
Member

Posts: 66
Joined: 2012-12-25

#5699396 Posted on: 08/12/2019 05:58 PM

Would love to see 1/10th of this speed in non-volatile memory. Not that networks / internal bandwidth could support it, but it would be nice to look at.

On a more relevant note, any word on pricing in comparison to the GDDR alternatives? Given HBMs past, I'm sure it's prohibitively expensive, so it won't make it down to the GPUs us mortals use. This part of the post gives me that impression as well:

You can pretty much tell where they plan to make all of their money on this.

Yogi
Senior Member

Posts: 276
Joined: 2015-06-25

#5699403 Posted on: 08/12/2019 06:13 PM

What about mobile device having APU + memory in 3x4 cm area. Imagine 6C/12T + iGPU performing at around 75% of 5700 XT.
Perfect 1080p gameplay at good power draw in thin laptop. Saved space from memory means extra cooling capacity, battery, another M.2, ...

I thought the old hades canyon NUC with the Intel and Vega processors on a single "chip" was one of the coolest bits of tech I've seen in quite a while. I am still kinda baffled as to why AMD hasn't tried to pursue this further especially with all their experience with interposers, chiplets, HBM, "Infinity Fabric" etc.

DEADPOOL3980
Member

Posts: 28
Joined: 2018-07-23

#5699419 Posted on: 08/12/2019 07:10 PM

I thought AMD used those HBM chips in their process for memory cache

Reddoguk
Senior Member

Posts: 2200
Joined: 2010-05-26

#5699481 Posted on: 08/12/2019 11:57 PM

16gb on a single package will be highly sort after in 2020 trust me.

If the price comes down i'd expect to see many top end GPUs using it.

Silva
Senior Member

Posts: 1627
Joined: 2013-06-04

#5699637 Posted on: 08/13/2019 12:34 PM

They where forced to use HBM to be competitive, they needed the memory speed and lower power usage.
HBM is still used on the top workstation cards, unless something bag happens with GDDR7, HBM will still be the best solution for high bandwidth and large capacity.
They were not competitive using that BS, it only sank the GPU side of the company. Plus, they didn't make any money on it.

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