Samsung Launches 3rd-generation (16GB) HBM2E
HBM2E stacks eight 16Gb DRAM dies to achieve 16GB package capacity and ensures a stable data transfer speed at 3.2Gbps
Samsung Electronics, the world leader in advanced memory technology, today announced the market launch of ‘Flashbolt’, its third-generation High Bandwidth Memory 2E (HBM2E). The new 16-gigabyte (GB) HBM2E is uniquely suited to maximize high performance computing (HPC) systems and help system manufacturers to advance their supercomputers, AI-driven data analytics and state-of-the-art graphics systems in a timely manner.
“With the introduction of the highest performing DRAM available today, we are taking a critical step to enhance our role as the leading innovator in the fast-growing premium memory market,” said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. “Samsung will continue to deliver on its commitment to bring truly differentiated solutions as we reinforce our edge in the global memory marketplace.”
Ready to deliver twice the capacity of the previous-generation 8GB HBM2 ‘Aquabolt’, the new Flashbolt also sharply increases performance and power efficiency to significantly improve next-generation computing systems. The 16GB capacity is achieved by vertically stacking eight layers of 10nm-class (1y) 16-gigabit (Gb) DRAM dies on top of a buffer chip. This HBM2E package is then interconnected in a precise arrangement of more than 40,000 ‘through silicon via’ (TSV) microbumps, with each 16Gb die containing over 5,600 of these microscopic holes.
Samsung’s Flashbolt provides a highly reliable data transfer speed of 3.2 gigabits per second (Gbps) by leveraging a proprietary optimized circuit design for signal transmission, while offering a memory bandwidth of 410GB/s per stack. Samsung’s HBM2E can also attain a transfer speed of 4.2Gbps, the maximum tested data rate to date, enabling up to a 538GB/s bandwidth per stack in certain future applications. This would represent a 1.75x enhancement over Aquabolt’s 307GB/s.
Samsung expects to begin volume production during the first half of this year. The company will continue providing its second-generation Aquabolt lineup while expanding its third-generation Flashbolt offering, and will further strengthen collaborations with ecosystem partners in next-generation systems as it accelerates the transition to HBM solutions throughout the premium memory market.
Leaked photos confirm rumors about Samsung Galaxy S20 - 01/13/2020 10:24 AM
Leaked photos seem to confirm that Samsung will not reveal the Galaxy S11 series on 11 February, but will switch to the Galaxy S20 series. It concerns three models: Samsung Galaxy S20, S20 Plus and S2...
Blackout at the Samsung factory should not affect DRAM prices in the first quarter of 2020 - 01/10/2020 11:12 AM
Earlier last week we reported that Samsung had a power outage at a a factory for semiconductors, the outage that lasted one minute put the plant down for over a day and brought production of DRAM and...
Samsung 980 PRO M.2 gets PCIe Gen4 and performance up to 6,500 MB/s - 01/09/2020 12:52 PM
Samsung will be releasing its first PCIe 4.0 SSDs dubbed the 980 Pro, and on that PCIe Gen 4.0 link it achieves read speeds of up to 6.5 GB/s, there will be three models. ...
Samsung T7 Touch Portable SSD (With a Fingerprint Sensor) is Out - 01/09/2020 10:46 AM
Samsung announced the release of its latest external storage device – the Portable Solid State Drive (SSD) T7 Touch – which combines sleek, compact design with the fastest transfer speeds currentl...
Samsung Electronics Unveils 2020 QLED 8K TV at CES - 01/06/2020 10:27 AM
Samsung Electronics introduced today its next-generation QLED 8K line at CES 2020 in Las Vegas, offering a glimpse into the future of display technology. ...
Senior Member
Posts: 12892
Joined: 2003-05-24
till such time where this all happens is just much more expensive ram that is currently being ignored for GDDR6 for majority of GPU's
Senior Member
Posts: 613
Joined: 2007-09-24
I don't think so...because then it will be "Big Expensive Navi"
HBM2 is ideal in situations such as AI and advanced computing because of the high bandwidth.
GDDR6 offers a lot of the same performance, albeit with higher power requirements, but at a lower price thus making it more suitable for everyday consumer graphics.
There is place on the market for both of them but I think that for us - "normal consumers" - hbm2 is still too expensive and maybe unnecessary compared with the performance needed in everyday tasks that can still be decently served by cheaper GDDR6.
Moderator
Posts: 15139
Joined: 2006-07-04
Doubt it. AMD only went to HBM because the power draw of their gpu and GDDR5X and GDDR6 together would have been way too high. HBM also isn't cheap.
Senior Member
Posts: 2952
Joined: 2013-03-10
AMD was one of the original developers of HBM. I bet they felt like they had to use it after that. No doubt they also believed it would make a real difference. Unfortunately still sticking to the old GCN made the change in the memory insufficient when at the same time Nvidia went forward with Maxwell and Pascal.
Senior Member
Posts: 2952
Joined: 2013-03-10
Haha. Nvidia P100 used it, V100 uses it, A/H100 will use it. Those are the goldmines for Nvidia. AMD also used and is using it to various levels of success. Nobody liked Rambus. I don't know why you'd compare HBM to that failure. HBM never had any problems and is working up to the specs and expectations. It's just not as cost efficient for private consumer use as GDDR, plus the supply was more limited, which is why Nvidia never bothered with it outside of the professional cards. However, it's serving Nvidia excellently in the expensive data center and such solutions.