Samsung Launches 3rd-generation (16GB) HBM2E
HBM2E stacks eight 16Gb DRAM dies to achieve 16GB package capacity and ensures a stable data transfer speed at 3.2Gbps
Samsung Electronics, the world leader in advanced memory technology, today announced the market launch of ‘Flashbolt’, its third-generation High Bandwidth Memory 2E (HBM2E). The new 16-gigabyte (GB) HBM2E is uniquely suited to maximize high performance computing (HPC) systems and help system manufacturers to advance their supercomputers, AI-driven data analytics and state-of-the-art graphics systems in a timely manner.
“With the introduction of the highest performing DRAM available today, we are taking a critical step to enhance our role as the leading innovator in the fast-growing premium memory market,” said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. “Samsung will continue to deliver on its commitment to bring truly differentiated solutions as we reinforce our edge in the global memory marketplace.”
Ready to deliver twice the capacity of the previous-generation 8GB HBM2 ‘Aquabolt’, the new Flashbolt also sharply increases performance and power efficiency to significantly improve next-generation computing systems. The 16GB capacity is achieved by vertically stacking eight layers of 10nm-class (1y) 16-gigabit (Gb) DRAM dies on top of a buffer chip. This HBM2E package is then interconnected in a precise arrangement of more than 40,000 ‘through silicon via’ (TSV) microbumps, with each 16Gb die containing over 5,600 of these microscopic holes.
Samsung’s Flashbolt provides a highly reliable data transfer speed of 3.2 gigabits per second (Gbps) by leveraging a proprietary optimized circuit design for signal transmission, while offering a memory bandwidth of 410GB/s per stack. Samsung’s HBM2E can also attain a transfer speed of 4.2Gbps, the maximum tested data rate to date, enabling up to a 538GB/s bandwidth per stack in certain future applications. This would represent a 1.75x enhancement over Aquabolt’s 307GB/s.
Samsung expects to begin volume production during the first half of this year. The company will continue providing its second-generation Aquabolt lineup while expanding its third-generation Flashbolt offering, and will further strengthen collaborations with ecosystem partners in next-generation systems as it accelerates the transition to HBM solutions throughout the premium memory market.
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HBM is possible, since they use It in Vega cards, although It is expensive.
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I figure AMD will use HBM for their x900 series GPUs, maybe x800. But it isn't cost effective for parts lower than that.
Do we really need 32GB HBM2?
IMhO 16GB will be plenty enough, even for 4k gaming.
I would prefer 4x stack over 2x stack any time... (4x4GB or 2x8GB or 4x8GB).
I'd say HBM is most suited for 12GB+ configurations. When it comes to GPUs, bandwidth needs go up with memory capacity needs. Memory capacity needs go up as you add more cores.
For professionals working in 4K and higher, I could see 32GB being a necessity. For certain server compute workloads, I could also see 32GB being useful.
For gamers, no - 32GB isn't necessary any time soon. We can barely run games at max detail in 4K above 60FPS (let alone at a reasonable price) and a lot of games can make due with 8GB.
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HBM i hear alot about but not really used by much of anything, this gona be come the new rambus ram?
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I don't think so. There are some pretty neat advantages to hbm, such as the very fast speeds and the close physical proximity to the processor. The line between memory and storage continues to blur, i can envision hbm being a pretty effective way to bridge the gap as it develops further, especially with all the fancy new 3d chip stacking and new interconnects. Only time will tell. 3 or 4 innovations have a way of leading to 1 innovation that makes the previous 3 or 4 obsolete, so maybe.
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Well those high resolutions like sweet 8k just need this insane vram buffer and bandwidth for all that data. Amd started using hbm since fury so its not impossible.