Ryzen 7 5800X3D is gonna be hard to get due to complex production stacked cache
The AMD Ryzen 7 5800X3D will be the only consumer-level processor to include an additional stacked 3D V-Cache that sit above the compute dies. And that's difficult and costly, the processor might end up being a limited edition.
According to Digitimes sources, TSMC's 3D SoIC technology is not yet in volume production, and limited capacity is available being allocated to enterprise chips. The Taiwan Semiconductor Manufacturing Company (TSMC) is building a new sophisticated packaging plant in Chunan, Taiwan, which is slated to be operational later this year, although it may not be ready in time for volume 5800X3D production prior to the release of Zen 4 later this year. AMD believes that the presence of all of that more L3 cache will result in a significant boost in gaming performance over the standard 5800X, which isn't exactly a slouch in the first place. But with the recent Alder Lake release, it might be enough to grab back the #1 position. The notion is that latency-sensitive applications such as games will benefit from not having to access the DRAM as frequently as they would otherwise have to. Although AMD claims that the technology can provide a 15 percent boost in performance, which is enough to put it ahead of the 12900K, we'll reserve final judgment until we've had a chance to test the 5800X3D for ourselves once we review it.
The Ryzen 7 5800X3D is scheduled to go on sale in spring 2022, so you'll have to wait a few months longer. If TSMC's limited manufacturing capacity remains until the middle of 2022 or beyond, it is possible that the 5800X3D will continue to be a niche processor. It is expected to be replaced by Zen 4 CPUs in the second half of 2022.
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Senior Member
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look folks there's no need for hand-wringing.
the 5800X3D is doing the exact same thing for AMD that Alder Lake is doing for Intel.
which is being a placeholder while generating sales for the next generation cpu arriving within 12 calendar months.
Intel wisely decided to "go big" in ironing out "Big/little". there's no substitute for full production to create an improved process.
Intel also is facing limitations in fabrication, but the team spirit is back.
AMD is faring better with TSMC than some of you seem to think. the reality is no one and nothing else are being fabbed at this fab for the 5800X3D and as i said there's no substitute for full production to enhance the node.
AMD knows you get what you paid for, which is the bleeding edge of fabrication. with all of the associated risks as well.
this is a "win" for everyone
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Posts: 7182
Joined: 2020-08-03
look folks there's no need for hand-wringing.
the 5800X3D is doing the exact same thing for AMD that Alder Lake is doing for Intel.
which is being a placeholder while generating sales for the next generation cpu arriving within 12 calendar months.
Intel wisely decided to "go big" in ironing out "Big/little". there's no substitute for full production to create an improved process.
Intel also is facing limitations in fabrication, but the team spirit is back.
AMD is faring better with TSMC than some of you seem to think. the reality is no one and nothing else are being fabbed at this fab for the 5800X3D and as i said there's no substitute for full production to enhance the node.
AMD knows you get what you paid for, which is the bleeding edge of fabrication. with all of the associated risks as well.
this is a "win" for everyone
one-off cpu vs whole line-up,including K and F skus,and they're the same ?
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Posts: 3020
Joined: 2017-08-18
essentially.
you are forgetting the part where i said "Intel wisely decided to "go big".
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Posts: 3020
Joined: 2017-08-18
the greatest power Intel has is market share and marketing.
this year they had the new tech to show off. even thought it is nascent and a placeholder.
the reality is that the new administration needed a new full line in the stores and marketing needed the shareholders to see progress on the production node.
period.
point made to the shareholders (like me) that were beginning (or had) to lose/lost faith.
all Intel really had to do was the I-9 1200k. but doing a full run down to I-3 proves they had (more or less) caught up with TSMC across multiple fab sites.
AMD does not have that legacy - it made bank off of that legacy, as did TSMC
what we are talking about with the 5800X3D is way more advanced than Foveros/EMIB that Intel is using.
which is why it is only being made at one fab site.
this isn't bad news, it means the technology will become less expensive and more common across multiple sites (eventually).
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I agree
it depends if you care for objective facts,like performance per dollar.
Not everyone does,sometimes people prefer to pay extra just for the brand and that's fine.
don't get that it's a crippled chip,half the cache and pcie 3.0
i'd rather just invest extra euros into something better
get a 5800x and don't look back