MSI MEG X670E Godlike gets 24+2+1 phases / Ryzen 7000 with up to 230 W

The MSI MEG X670E Godlike board design for AMD's upcoming Ryzen 7000 series Raphael desktop processors based on the new Zen 4 architecture reveals a very powerful voltage modulation based on a 24+2+1 phase design and 105 amp strong MOSFET.

A media outlet obtained the expected technical specifications, drawings, and images of the MSI MEG X670E Godlike. The PCB design of the large 305 288 mm E-ATX main board reveals a powerful power supply. Wccftech mentions a "24+2+1 Phase (105A) CPU VRM Design," as well as "105A MOSFETs" and "Dual 8-Pin Power Connectors for CPU," implying an upcoming spearhead in MSI's AM5 portfolio. It remains to be seen how the phases will be switched (addressed in groups by the VRM controller). Some manufacturers have already introduced AM4 mainboards with a wide voltage range for the November 2020 release of Ryzen 5000 (test), but with Zen 4 on the X670E chipset, there will be another significant upgrade. The MSI MEG X570 Godlike from 2019, the direct predecessor, still managed 16 phases and MOSFETs with 70 amps each.

Raphael with Zen 4 is said to boost single-core performance by more than 15%. The IPC could increase by 8 to 10%, with the higher clock providing additional performance. In all likelihood, even in the new 5 nm process, this will not be possible without higher consumption, which is why the TDP in the future will be up to 170 watts, and the PPT of the socket AM5 will be up to 250 watts. To date, the maximum TDP was 105 watts and the maximum PPT was 142 watts. MSI appears to consider this with the MEG X670E Godlike, while also emphasizing the mainboard's special suitability for overclocking.

MSI MEG X670E Godlike

• Support for AMD Ryzen 7000 series desktop CPUs
• Support for up to 128 gigabytes of DDR5-5600+ (OC) with AMD EXPO
• 24+2+1 phase design with 105 amp MOSFETs
• Dual X670E "Promontory" PCH ("AMD X670E")
• 2 oz copper pc with 10 layer design
• 3× PCIe Gen 5.0 x16 (x16/x8/x8)
• 4x M.2, 1x PCIe 5.0, 3x PCIe 4.0
• 2× USB 3.2 Type-C Gen 2×2
• Wi-Fi 6E with 2×2 MIMO
• 305×288mm