JEDEC to Enable Standard 3D Models of Electronic Components

JEDEC announced that its JC-11 Mechanical Standardization Committee will be releasing 3D models of new standard modules, packages, and socket outlines in addition to the detailed 2D drawings developed today. 

The 3D CAD models will be three-dimensional representations of the two-dimensional mechanical drawings offered by the committee and will be provided in a standard universal format so as to be importable by most common 3D CAD software packages used in the industry. 

In addition, the JC-11 committee has developed and published a new standard XML schema under JEP30, which aligns to the recently published JESD30H document to enable software to generate 3D models automatically based on user or database inputs.  “The demand for 3D models in electronics design and manufacturing is set to grow exponentially with the expansion of the Internet of Things and the drive towards Digital Manufacturing through automation.  JEDEC is helping to enable this growth through the development of 3D models for our standard designs to complement the 2D drawings offered today and by establishing a universal schema for presenting real part data to software.  These resources will greatly reduce time to market, eliminate opportunities for human error, and reduce manufacturing costs across the industry.” said John Norton, JEDEC JC-11 Chairman.

This development work is consistent with JEDEC’s mission to serve the microelectronics industry by lowering design and system costs.