Intel reportedly is planning to add USB 3.1 and Wi-Fi functionality housed directly inside their motherboard chipsets, likely starting at 300-series scheduledwhich would be released at the end of 2017.

The decision is expected impact existing third-party Wi-Fi and USB 3.1 chip makers including Broadcom, which is a major supplier of notebook WLAN chips, Realtek Semiconductor, a major supplier of desktop WLAN chips and ASMedia Technology, which has a major share in the USB 3.1 market.

Although ASMedia is expected to see dropping orders for USB 3.1 host chips, the standardization of USB 3.1 technology will accelerate development of USB 3.1-based devices and increase demand for related chips and 10G signal redrivers and retimers, allowing ASMedia to land new orders. ASMedia's orders from AMD for its high-speed transmission interface chipset are expected to further lower the impact from Intel's plan.

Intel Will Add Wi-Fi and USB 3.1 support into next-gen chipsets